Rodrigo Martins

In the past we have developed a transient technique, called the Flying Spot Technique (FST). FST allows, not only to infer the ambipolar diffusion length but also the effective lifetime of the photogenerated carriers once the light spot velocity and geometry of the structure were known. In this paper, we propose to apply this technique backwards in order to detect the path and velocity of an object that is moving in the direction of a light source. The light reflected back from the object is analyzed through a p.i.n structure being the transient transverse photovoltage dependent on the movement of the object (position and velocity). Assuming that the transport properties of the material and the geometry of the device are known and using a triangulation method we show that it is possible to map the movement of the object. Details concerning material characterization, simulation and device geometry are presented.

PIN devices based on hydrogenated amorphous silicon (a-Si:H) became fundamental elements of many different types sensors, based on either the transverse or the lateral photovoltaic effect. In the past we have developed a transient technique, called the Flying Spot Technique (FST), based on the lateral photoeffect. FST allows, not only to infer the ambipolar diffusion length but also the effective lifetime of the photogenerated carriers once the light spot velocity and geometry of the structure were known. In this paper we propose to apply this technique backwards in order to detect the path and velocity of an object that is moving in a light source direction. The light reflected back from the object is analyzed through p.i.n. structure being the transient transverse photovoltage dependent on the object movement (position and velocity). Assuming known the transport properties of the material and the geometry of the device and using a triangulation method we show that it is possible to map the object movement. Details concerning material characterization, simulation and device geometry are presented.

In this paper we present a study on the electrical characteristics (conductivity, σ and relative dielectric constant, εr) of amorphous silicon nitride (a-SixN1-x) and carbide (a-SixC1-x) films deposited by PECVD, used as dielectric materials in TFT devices, aiming to select the most adequate alloy that lead to improve device performances. Besides that, double stack a-SixN1-x/a-SixC1-x structures were developed and applied as dielectric layers on TFTs, whose performances show to be superior to those ones using single silicon nitride or silicon carbide as dielectric.

The use of ITO thin films on glass/ITO/p-i-n/metal amorphous silicon solar cells is reviewed. It is suggested a new application for silicon monoxide thin films on the ITO-p interface, as an intermediate layer, to minimize the ITO thin film deterioration process, during the early stage of exposure to a silane plasma rich in hydrogen. The thickness of the silicon monoxide thin films is chosen not to worsen the optical and electrical properties of the ITO thin films. The ITO-p interface is optimized (due to impurities diffusion decrease), leading to an overall improvement of the device performance.

The use of ITO films on glass/ITO/p-i-n/metal amorphous silicon solar cells is reviewed. It is suggested a new application for silicon monoxide thin films on the ITO-p interface, as an intermediate layer, to minimize the ITO thin film deterioration process, during the early stage of exposure to a silane plasma rich in hydrogen. The thickness of the silicon monoxide thin films is chosen not to worsen the optical and electrical properties of the ITO thin films. The ITO-p interface is optimized (due to impurities diffusion decrease), leading to an overall improvement of the device performance.

In this work we study the optical and electrical behavior of ZnO:Ga, ITO and IZO films deposited on glass after sustaining different hydrogen plasma conditions and exposure times. This work was complemented by analyzing the surface morphology of the set of films, which allow us to determine the role of hydrogen plasma on the film's properties such as Hall mobility, free carrier concentration, sheet resistance, optical transmittance, figure of merit and state of the surface. Apart from that, the performances of solar cells using an intrinsic layer constituted by nanocrystalline silicon will be also presented. The data show that the electrical properties of solar cells were improved by using ZnO:Ga as front contact, allowing a high current density collection and single pin solar cells with efficiencies exceeding 11%. © 2005 Materials Research Society.

Titanium oxide (TiO 2) finds potential applications in various fields such as solar cells, optical coatings due to its high refractive index and it also has been widely used in memory devices owing to its high dielectric constant. TiO 2 films have been deposited on p-type silicon (100) substrates by RF magnetron sputtering technique. Thickness, structure and surface morphology of the films were analyzed by using α-step profilometer, Raman spectroscopy and atomic force microscope respectively. Thin film capacitors of the type Al/TiO 2/Si were fabricated by evaporation of Aluminium on to the TiO 2 films. The current - voltage and capacitance - voltage characteristics were carried out to understand the electrical conduction and dielectric properties of the deposited films with a stack of Al/TiO 2/Si. The leakage current density was decreased and capacitance was increased with increase of substrate bias voltage.

Two self-buffer layers were grown on c-plane sapphire substrates by atmospheric MOCVD method using DEZn, tert-butanol as precursors and H 2 as carrier gas. Then, they were respectively annealed in growth process and oxygen environment. After that, ZnO films were respectively grown on them. XRD spectra show that all the films were grown in [002] orientation. Furthermore, the film with a buffer layer annealed in oxygen exhibits much higher crystal quality. Its FWHM of the rocking curve is only 567arcsec. Furthermore, its Raman scattering spectrum appears a much stronger E2 mode peak at 436cm-1 and its PL spectrum appears a shoulder at 3.367eV on the higher energy side. © 2006 WILEY-VCH Verlag GmbH & Co. KGaA,.

This work deals with the role of hydrogen dilution and filament temperature on the morphology, structure and electrical properties of nanocrystalline boron doped silicon carbide thin films produced by hot-wire technique. The structural and morphological data obtained by XRD, SEM and micro-Raman show that for filament temperatures and hydrogen dilutions above 2100 °C and 90%, respectively, the surface morphology of the films is granular with a needle shape, while for lower filament temperatures and hydrogen dilutions the surface morphology gets honeycomb like. The SIMS analysis reveals that films produced with filament temperatures of about 2200 °C and hydrogen dilution of 99% present a higher hydrogen and carbon incorporation than the films produced at lower temperatures and hydrogen dilutions. These results agree with the electrical and optical characteristics recorded that show that the films produced exhibit optical gaps in the range from 1.8 to 2 eV and transverse conductivities ranging from 10-1 S/cm to 10-3 S/cm, consistent with the degree of films crystallinity and carbon incorporation recorded.

Large area thin film position sensitive detectors based on amorphous silicon technology have been prepared on polyimide substrates using the conventional plasma enhanced chemical vapour deposition technique. The sensors have been characterised by spectral response, illuminated I-V characteristics and position detectability measurements. The obtained one dimensional position sensors with 5 mm wide and 60 mm long present a maximum spectral response at 600 nm, an open circuit voltage of 0.6 V° and a position detectability with a correlation of 0.9989 associated to a standard deviation of 1 × 10-2, comparable to those ones produced on glass substrates. The surface of the sensors at each stage of fabrication was investigated by Atomic Force Microscopy.

We have developed a rectangular dual-axis large area Position Sensitive Detector (PSD), with 5 cm×5 cm detection area, based on PIN hydrogenated amorphous silicon (a-Si:H) technology, produced by Plasma Enhanced Chemical Vapor Deposition (PECVD). The metal contacts are located in the four edges of the detected area, two of them located on the back side of the ITO/PIN/Al structure and the others two located in the front side. The key factors of the detectors resolution and linearity are the thickness uniformity of the different layers, the geometry and the contacts location. Besides that, edge effects on the sensor's corner disturb the linearity of the detector. In this paper we present results concerning the linearity of the detector as well as its optoelectronic characteristics and the role of the i-layer thickness on the final sensor performances.

We present the modelling of a new two-terminal and low-voltage operating optoelectronic device based on MIS silicon structure with multichannel insulator and having as gate a transparent metallic tin-doped indium oxide (ITO) layer deposited by spray pyrolysis technique over the insulator layer. ITO layer has a multiple non-rectifier electrical contact with silicon substrate, in the SiO2 channel's region. Construction details of the process, together with its operating characteristics are given. The devices developed do not require external active electronic components (transistors, microschemes) to execute their functions and to transform analogue input optical signals to digital output form, highly important for a wide range of optoelectronic applications.

A linear array thin film position sensitive detector (LTFPSD) based on hydrogenated amorphous silicon (a-Si:H) is proposed for the first time, taking advantage of the optical properties presented by a-Si:H devices we have developed a LTFPSD with 128 integrated elements able to be used in 3-D inspections/measurements. Each element consists on a one-dimensional LTFPSD, based on a p.i.n. diode produced in a conventional PECVD system, where the doped layers are coated with thin resistive layers to establish the required device equipotentials. By proper incorporation of the LTFPSD into an optical inspection camera it is possible to acquire information about an object/surface, through the optical cross-section method. The main advantages of this system, when compared with the conventional CCDs, are the low complexity of hardware and software used and that the information can be continuously processed (analogue detection).

In this paper we report the success in fabricating FTO/Si surface-barrier photodiodes produced by spray pyrolysis deposition technique, under ambient conditions. Three types of photodetectors for low-voltage-bias operation were developed based on high-resistivity silicon: 1. X-Ray detectors with energy resolution of 16.5% at 661.5 keV (137Cs source), consisting of surface-barrier PIN photodiode with an active area of 50 mm2 operating at 5 V reverse bias, scintillator based on monocrystalline Bi4Ge3O12 and preamplifier (noise of 250 e- RMS.); 2. Fast-response surface-barrier FTO/n–n+ silicon epitaxial photodiodes, operating at 10 V bias with rise times of 2 ns at λ = 0.85 μm; 3. Radiation-resistant drift epitaxial surface-barrier PIN photodiodes for unbiased operating conditions, with an exponential impurity distribution in a 8 μm thick epitaxial layer. A built-in electrical field due to the carrier concentration distribution in the epitaxial layer provides a considerable improvement in the `critical fluence' value (3×1014 cm-2) for neutron irradiation.

The devices analyzed in this work present an S-shape J-V characteristic when illuminated. By changing the light flux a non linear dependence of the photocurrent with illumination is observed. Thus a low intensity light beam can be used to probe the local illumination conditions, since a relationship exists between the probe beam photocurrent and the steady state illumination. Numerical simulation studies showed that the origin of this S-shape lies in a reduced electric field across the intrinsic region, which causes an increase in the recombination losses. Based on this, we present a model for the device consisting of a modulated barrier recombination junction in addition to the p-i-n junction. The simulated results are in good agreement with the experimental data. Using the presented model a good estimative of the LSP signal under different illumination conditions can be obtained, thus simplifying the development of applications using the LSP as an image sensor, with advantages over the existing imaging systems in the large area sensor fields with the low cost associated to the amorphous silicon technology. © 2007 Materials Research Society.

The introduction into a traditional p.i.n structure of two defective buffer layers near the p/i and i/n interfaces can improve the device stability and efficiency through an enhancement of the electric field profile at the interfaces and a reduction of the available recombination bulk centers. The defectous layer ("i′-layer"), grown at a higher power density, present a high density of defects and acts as "gettering centers" able to tailor light induced defects under degradation conditions. If the i-layer density of states remains below 1016 eV-1 cm-3 and assuming a Gaussian distribution of defect states, the gettering center distribution will not affect significantly the carrier population but only its spatial distribution. We report here about a device numerical simulation that allows us to analyse the influence of the "i′-layer" position, thickness and density of states on the a-Si: H solar cells performances. Results of some systematic simulation from the ASCA program (Amorphous Solar Cell Analysis), and for different configurations will be presented. © 1994 Materials Research Society.

Molybdenum doped indium oxide (IMO) thin films rf sputtered at room temperature were studied as a function of oxygen volume percentage (O 2 vol. %) varied between 0 and 17.5. The as-deposited films were amorphous irrespective of O2 vol. %. The minimum transmittance (<10 %) of the films deposited without oxygen has been increased on introducing oxygen (3.5 O2 vol. %) to a maximum of 90 %. The optical band gap has been increased from 3.80 eV (without oxygen) to 3.92 eV (3.5 O 2 vol. %). The films were highly resistive and the hall coefficients were detectable only for the films deposited without oxygen. In order to increase the electrical conductivity, the films were annealed in the range 100-500° C in open-air and N2/H: gas for 1 hour. The annealed films become polycrystalline with enhanced electrical and optical properties. The effect of annealing conditions on these films will be presented and discussed in detail. © 2006 Materials Research Society.

In this work we present sputtered multicomponent dielectrics based on mixtures of HfO 2 and SiO 2. This way it is possible to get stable amorphous structure up to 800°C, that does not happen for pure HfO 2, for instance, that present a polycrystalline structure when deposited without any intentional substrate heating. Besides, also the band gap of the resulting films is increased when compared with pure HfO2 that theoretically is an advantage in getting a suitable band offset with the semiconductor layer on oxide TFTs. Concerning the electrical characterization, the leakage current on c-Si MIS structures is low as 10 -9 Acm -2 at 10 V. The amorphous structure of the films also lead to better dielectric/semiconductor interfaces, as suggested by C-V characteristics on GIZO MIS structures, which do not present strong variation with frequency. On other hand, the dielectric constant decreases due to the incorporation of SiO 2 and Al 2O 3. Further improvement on insulating and interface characteristics is achieved using multilayer stacks and substrate bias during deposition. © 2012 Copyright Society of Photo-Optical Instrumentation Engineers (SPIE).

The recent application of wide band gap oxide semiconductors to transparent thin film transistors (TTFTs) is making a fast and growing (r)evolution on the contemporary solid-state electronics. In this paper we present some of the recent results we have obtained using wide band gap oxide semiconductors, like indium zinc oxide, produced by rf sputtering at room temperature. The devices work in the enhancement mode and exhibit excellent saturation drain currents. On-off ratios above 106 are achieved. The optical transmittance data in the visible range reveals average transmittance higher than 80%, including the glass substrate. Channel mobilities are also quite respectable, with some devices presenting values around 25 cm2/Vs, even without any annealing or other post deposition improvement processes. The high performances presented by these TTFTs associated to a high electron mobility, at least two orders of magnitude higher than that of conventional amorphous silicon TFTs and a low threshold voltage, opens new doors for applications in flexible, wearable, disposable portable electronics as well as battery-powered applications.

This paper presents the results of a preliminary study to examine the ability of post-silicon devices for analog processing. It is focused on the latest thin-film transistors (TFTs) with amorphous gallium-indium-zinc oxide (a-GIZO) as active layer. Three circuit configurations are presented: a differential pair and two multiplier topologies. Both triode and saturation regions of operation are included in the analysis, with the devices set to remain in strong accumulation. A neural model, which is developed based on the measured data of the TFTs, is used for the circuit simulations in the Cadence Virtuoso environment. The analog multipliers simulation results are compared against the expected functional results. © 2012 IEEE.

The role of the deposition pressure (p) and the type of filaments (tungsten, W or tantalum, Ta) used to produce large area (10cm×10cm) n-type Si:H films by hot wire chemical vapour (HW-CVD) deposition technique was investigated. The data show that the electro-optical properties of the films produced are dependent on the gas pressure used. In the pressure range of 1×10-3 Torr to 1.0 Torr, the room dark conductivity (σd) varies from 1×10-8 to 2 S/cm for films produced at the same hydrogen dilution and filament temperature (Tfil). On the other hand, the hydrogen concentration (CH) decreases from 10% to 2%, while the growth rate (R) shows an exponential increase, from 1 to 9 Å/s. The SIMS analysis, within the detection limits, does not reveal the existence of any significant W or Ta contamination in the films produced.

In this work, we show results concerning electro-optical properties, composition and morphology of nanocrystalline hydrogenated undoped silicon (nc-Si:H) films produced by hot wire plasma assisted chemical vapour deposition process (HWPA-CVD) and exhibiting a compact granular structure, as revealed by SEM micrographs. This was also inferred by infrared spectra, which does not present the SiO vibration band located at 1050-1200 cm-1, even when samples have long atmospheric exposition. The photoconductivity measured at room temperature also does not change when samples have a long time exposition to the air or to the light irradiation. The influence of hydrogen dilution on the properties of the films was also investigated.

This paper presents the process conditions that lead to the production of nanostructured silicon films grown by plasma enhanced chemical vapour deposition close to the so-called gamma regime (powder formation), highly dense and with low density of bulk states. Thus, the powder management is one important issue to be addressed in this paper. As a general rule we observed that high quality films (low density of states and high μτ products) are obtained when films are grown under low ion bombardment at high hydrogen dilution and deposition pressure conditions, to allow the proper surface passivation and surface activation.

In this paper we present results concerning the influence of laser energy and shot density on the electrical resistance, X-ray diffraction pattern, and structure obtained by SEM, on recrystallized a-Si:H thin films produced by using a Nd-YAG laser, working in a wavelength of 532 nm. The base material (undoped and doped a-Si:H) was obtained by Plasma Enhanced Chemical Vapour Deposition (PECVD). The structure and electrical characteristics of the recrystallized thin films are dependent on the laser beam energy density, beam spot size and the number of shots applied to the base a-Si:H thin film used. Overall, the data show recrystallized material with grain sizes larger than 1μm, where the electrical resistance of both, undoped and doped materials, can be varied up to 5 orders of magnitude, by the proper choice of the recrystallization conditions.