Rodrigo Martins

We present here a two-dimensional numerical simulation of a hydrogenated amorphous silicon p-i-n solar cell non-uniformly illuminated through the p-layer. This simulation is used to show the effect of the presence of dark regions in the illuminated surface on the electrical behaviour of the device. The continuity equations for holes and electrons together with Poisson's equation, implemented with a recombination mechanism reflecting the amorphous structure of the material, are solved using standard numerical techniques over a rectangular domain. The results obtained reveal the appearance of a lateral component of the electric field and current density vectors inside the structure. The effect of such components is a lateral carrier flow of electrons inside the intrinsic layer and of holes inside the p-layer, resulting in leakage of the transverse current collected at the contacts and an increase in the series resistance.

In today's main crystalline silicon (c-Si) applications in MOS (metal-oxide-silicon), MIS (metal-insulator-semiconductor) or SIS (Semiconductor-Insulator-Semiconductor), the growing of the oxide layer plays the main role, dictating the device performances, in particular if it has to be grown by a low temperature process. Of fundamental importance is the SiO2 interface with the c-Si. A very low defect density interface is desirable so that the number of trapping states can be reduced and the devices performance optimised. A two step low temperature oxidation process is proposed. The process consists of growing first a layer of oxide by a wet process and then treating the grown oxide with an oxygen plasma. The oxygen ions from the plasma bombard the oxide causing compaction of the oxide and a decrease in the interface roughness and defect density. Infrared spectroscopy and spectroscopic ellipsometry measurements were performed on the samples to determine the oxide thickness, optical and structural properties. SIS structures were built and capacitance measurements were performed under dark and illuminated conditions from which were inferred the interface defect density and correlated with the oxide growth process.

In this paper we report by the first time tunneling tranport on vertical μcSi/aSixCyOz:H/μcSi (μcaμc) heterostructures produced in a Two consecutive Decomposition and Deposition Chamber system where a Negative Differential Conductance is observed even at room temperature. Giant bias anomalies are observed, that decrease with temperature. Tunneling spectroscopy data are also reported for samples measured at low temperatures. A qualitative information of the recorded data is obtained and related with main features of the heterostructure. Nevertheless in this stage is hard to take quantitative information. © 1989.

Microcrystalline silicon is a two-phase material. Its composition can be interpreted as grains of crystalline silicon imbedded in an amorphous silicon tissue, with a high concentration of danglind bonds in the transition regions. In this paper, results obtained by means of numerical simulations about the transport properties of a μc-Si:H p-i-n junction are reported. The role played by the boundary regions between the crystalline grains and the amorphous matrix is taken in account, and these regions are treated similarly to a heterojunction interface. The influence of the local electric field at the grains boundary transition regions on the internal electric configuration of the device is outlined under illumination and applied external bias. © 1999 Elsevier Science S.A. All rights reserved.

This paper presents results of the role of the oxygen partial pressure used during the deposition process on the transport properties exhibited by doped microcrystalline silicon oxycarbide films produced by a Two Consecutive Decomposition and Deposition Chamber system, where a spatial separation between the plasma and the growth regions is achieved. This paper also presents the interpretative models of the optoelectronic behaviour observed in these films (highly conductive and transparent with suitable properties for optoelectronic applications) as well as the interpretation of the growth process that leads to film's microcrystallization.

This paper presents results of the role of the oxygen partial pressure (pO2) used on the properties exhibited by doped μc silicon oxycarbide films produced by a Two Consecutive Decomposition and Deposition Chamber (TCDDC) system [1], where a spatial separation between the plasma and the growth regions is achieved. The films produced are highly conductive and transparent with suitable properties for optoelectronic applications.

Microcrystalline silicon is a two-phase material. Its composition can be interpreted as a series of grains of crystalline silicon imbedded in an amorphous silicon tissue, with a high concentration of dangling bonds in the transition regions. In this paper, results for the transport properties of a μc-Si:H p-i-n junction obtained by means of two-dimensional numerical simulation are reported. The role played by the boundary regions between the crystalline grains and the amorphous matrix is taken into account and these regions are treated similar to a heterojunction interface. The device is analyzed under AM1.5 illumination and the paper outlines the influence of the local electric field at the grain boundary transition regions on the internal electric configuration of the device and on the transport mechanism within the μc-Si:H intrinsic layer.

N- and p-type weakly absorbing and highly conductive microcrystalline thin μc-Six:Cy:Oz:H films, have been produced by a TCDDC (Two Consecutive Decomposition and Deposition Chamber) system1. The optoelectronic and structural results show that we are in the presence of a mixed phase of Si microcrystals (c-islands) embedded in a-Six:Cy:Oz:H (a-tissue). Based on that, we propose a model where transport mechanisms are explained by the potential fluctuations related to films heterogeneities. Thus, conduction is due to carriers that by tunneling or percolation "pass" or "go" trough the barriers and/or percolate randomly by the formed channels. © 1989.

This paper discusses the electron transport in the n-type amorphous indium-zinc-oxygen system produced at room temperature by rf magnetron sputtering, under different oxygen partial pressures. The data show that the transport is not band tail limited, as it happens in conventional disordered semiconductors, but highly dependent on its ionicity, which explains the very high mobilities (≥ 60 cm 2 V -1 s -1) achieved. The room temperature dependence of the Hall mobility on the carrier concentration presents a reverse behaviour than the one observed in conventional crystalline/polycrystalline semiconductors, explained mainly by the presence of charged structural defects in excess of 4 × 10 10 cm -2 that scatter the electrons that pass through them. © 2005 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.

In this paper, we present the optical, electrical, structural and mechanical properties exhibited by aluminum-doped zinc oxide (ZnO:Al) thin films produced by RF magnetron sputtering on polymeric substrates (polyethylene terephthalate, PET; Mylar type D from Dupont®) with a standard thickness of 100 μm. The influence of the uniaxial tensile strain on the electrical resistance of these films was evaluated in situ for the first time during tensile elongation. In addition, the role of the thickness on the mechanical behavior of the films was also evaluated. The preliminary results reveal that the increase in electrical resistance is related to the number of cracks, as well as the crack width, which also depends on the film thickness. © 2002 Elsevier Science B.V. All rights reserved.

P-type thin-film transistors (TFTs) using room temperature sputtered SnOx (x<2) as a transparent oxide semiconductor have been produced. The SnOx films show p-type conduction presenting a polycrystalline structure composed with a mixture of tetragonal Β-Sn and α -SnOx phases, after annealing at 200 °C. These films exhibit a hole carrier concentration in the range of ≈ 1016 - 1018 cm-3; electrical resistivity between 101 - 102 cm; Hall mobility around 4.8 cm2 /V s; optical band gap of 2.8 eV; and average transmittance ≈85% (400 to 2000 nm). The bottom gate p-type SnOx TFTs present a field-effect mobility above 1 cm2 /V s and an ON/OFF modulation ratio of 103. © 2010 American Institute of Physics.

Transparent electronics is emerging as one of the most promising technologies for the next generation of electronic products, away from the traditional silicon technology. It is essential for touch display panels, solar cells, LEDs and antistatic coatings. The book describes the concept of transparent electronics, passive and active oxide semiconductors, multicomponent dielectrics and their importance for a new era of novel electronic materials and products. This is followed by a short history of transistors, and how oxides have revolutionized this field. It concludes with a glance at low-cost, disposable and lightweight devices for the next generation of ergonomic and functional discrete devices. Chapters cover: Properties and applications of n-type oxide semiconductors P-type conductors and semiconductors, including copper oxide and tin monoxide Low-temperature processed dielectrics n and p-type thin film transistors (TFTs) - structure, physics and brief history Paper electronics - Paper transistors, paper memories and paper batteries Applications of oxide TFTs - transparent circuits, active matrices for displays and biosensors Written by a team of renowned world experts, Transparent Oxide Electronics: From Materials to Devices gives an overview of the world of transparent electronics, and showcases groundbreaking work on paper transistors. © 2012 John Wiley & Sons, Ltd.

The degradation of thin-film transistors (TFTs) caused by the self-heating effect constitutes a problem to be solved for the next generation of displays. Aluminum nitride (AlN) is a viable alternative for gate dielectric of TFTs due to its good thermal conductivity, matching coefficient of thermal expansion to indium-gallium-zinc-oxide, and excellent stability at high temperatures. Here, AlN thin films of different thicknesses were fabricated by a low temperature reactive radio-frequency magnetron sputtering process, using a low cost, metallic Al target. Their electrical properties have been thoroughly assessed. Furthermore, the 200 nm and 500 nm thick AlN layers have been integrated as gate-dielectric in transparent TFTs with indium-gallium-zinc-oxide as channel semiconductor. Our study emphasizes the potential of AlN thin films for transparent electronics, whilst the functionality of the fabricated field-effect transistors is explored and discussed. © 2016 Elsevier B.V. All rights reserved.

This paper characterizes transparent current mirrors with n-type amorphous gallium-indium-zinc-oxide (a-GIZO) thin-film transistors (TFTs). Two-TFT current mirrors with different mirroring ratios and a cascode topology are considered. A neural model is developed based on the measured data of the TFTs and is implemented in Verilog-A; then it is used to simulate the circuits with Cadence Virtuoso Spectre simulator. The simulation outcomes are validated with the fabricated circuit response. These results show that the neural network can model TFT accurately, as well as the current mirroring ability of the TFTs. © 2005-2012 IEEE.

This paper analyzes transparent two-TFT current mirrors using a-GIZO TFTs with different mirroring ratios. In order to achieve a high mirroring ratio, the output TFT in the circuit employed a fingered structure layout to minimize area and overlap capacitance. The analysis of the current mirrors is performed in three phases. In the first, a radial basis function based (RBF) model is developed using measured data from fabricated TFTs on the same chip. Then, in the second phase, the RBF model is implemented in Verilog-A that is used to simulate two-TFT current mirrors with different mirroring ratios. The simulations are carried out using Cadence spectre simulator. In the third phase, simulation results are validated with the measured response from the fabricated circuits. © 2014 IEEE.

This paper deals with a new process to improve the stability of a-Si:H pin solar cells deposited in a single batch process by proper passivation of the interfaces. The process consists in removing partially a deposited sacrificial oxide layer grown between the p/i or i/n interfaces by SF6 etching. This layer is an absorber of defects and impurities that are introduced in the interfaces, mainly from the chamber walls and the substrate surface. The results achieved in laboratory samples lead to devices in which the fill factor and short circuit current density were improved respectively towards 75% and 16.5 mA cm-2, with a final working efficiency of about 9.5%. © 2001 Elsevier Science Ltd. All rights reserved.

Solution based deposition has been recently considered as a viable option for low-cost flexible electronics. In this context research efforts have been increasingly centred on the development of suitable solution-processed materials for oxide based transistors. Nevertheless, the majority of synthetic routes reported require the use of toxic organic solvents. In this work we report on a new environmental friendly solution combustion synthesis route, using ethanol as solvent, for the preparation of indium/gallium free amorphous zinc-tin oxide (ZTO) thin film transistors (TFTs) including AlOx gate dielectric. The decomposition of ZTO and AlOx precursor solutions, electrical characterization and stability of solution processed ZTO/AlOx TFTs under gate-bias stress, in both air and vacuum atmosphere, were investigated. The devices demonstrated low hysteresis (ΔV=0.23 V), close to zero turn on voltage, low threshold voltage (VT=0.36 V) and a saturation mobility of 0.8 cm2 V-1 s-1 at low operation voltages. Ethanol based ZTO/AlOx TFTs are a promising alternative for applications in disposable, low cost and environmental friendly electronics. © 2015 IOP Publishing Ltd.

This work analyzes the role of processing parameters on the electrical performance of GIZO (Ga2 O3: In2 O3:ZnO) films and thin-film transistors (TFTs). Parameters such as oxygen partial pressure, deposition pressure, target composition, thickness, and annealing temperature are studied. Generally, better devices are obtained when low oxygen partial pressure is used. This is related to the damage induced by oxygen ion bombardment and very high film's resistivity when higher oxygen partial pressures are used. Low deposition pressures and targets with richer indium compositions led to films with high carrier concentration, resulting in transistors with field-effect mobility as high as ∼80 cm2 Vs but poor channel conductivity modulation, becoming ineffective as switching devices. Nevertheless, it is demonstrated that reducing the GIZO thickness from 40 to 10 nm greatly enhances the switching behavior of those devices, due to the lower absolute number of free carriers and hence to their easier depletion. Annealing also proves to be crucial to control device performance, significantly modifying GIZO electrical resistivity and promoting local atomic rearrangement, being the optimal temperature determined by the as-produced films' properties. For the best-performing transistors, even with a low annealing temperature (150°C), remarkable properties such as μFE =73.9 cm2 Vs, onoff ratio≈7× 107, VT ≈0.2 V, and S=0.29 Vdec are achieved. © 2008 The Electrochemical Society.

Here we present for the first time a TiO2/Cu2O all-oxide heterojunction solar cell entirely produced by spray pyrolysis onto fluorine doped tin oxide (FTO) covered glass substrates, using silver as a back contact. A combinatorial approach was chosen to investigate the impact of the TiO2 window layer and the Cu2O light absorber thicknesses. We observe an open circuit voltage up to 350 mV and a short circuit current density which is strongly dependent of the Cu2O thickness, reaching a maximum of  0.4 mA/cm2. Optical investigation reveals that a thickness of 300 nm spray pyrolysis deposited Cu2O is sufficient to absorb most photons with an energy above the symmetry allowed optical transition of 2.5 eV, indicating that the low current densities are caused by strong recombination in the absorber that consists of small Cu2O grains. © 2014 Elsevier Ltd. All rights reserved.

Copper oxide (Cu2 O) thin films were used to produce bottom gate p-type transparent thin-film transistors (TFTs). Cu2 O was deposited by reactive rf magnetron sputtering at room temperature and the films exhibit a polycrystalline structure with a strongest orientation along (111) plane. The TFTs exhibit improved electrical performance such as a field-effect mobility of 3.9 cm2 /V s and an on/off ratio of 2× 102. © 2010 American Institute of Physics.

Thin-film transistors (TFTs) were fabricated using a 20-nm-thick indium molybdenum oxide (IMO) semiconductor layer at room temperature. The grazing incidence X-ray diffraction patterns confirmed that the deposited films are amorphous. The average transmittance (400-2500 nm) and the optical band gap are ∼88% and 3.95 eV, respectively. The TFTs fabricated on glass substrates showed a saturation mobility of 4.0 cm2/Vċ s with an I ON/IOFF ratio of 2 × 103 and a threshold voltage of-1.1 V, which are encouraging preliminary results in order to develop IMO as high-performance semiconductor layer. © 2011 IEEE.

The reduction of the In2O3 caused by the deposition of μc-Si:C:H by means of plasma-enhanced CVD, is considerably diminished if a thin (50 Å) silicon monoxide layer is applied as a diffusion barrier. The amount of reduced indium diminishes by a factor three while the amount of silicon oxide is also less, although SiO was added on purpose. First results on an amorphous silicon In2O3/pi junction show that the SiO layer benefits the opto-electrical characteristics. © 1991.

Pd-metal/insulator/semiconductor based on hydrogenated amorphous silicon were produced by plasma enhanced chemical vapour deposition with two different oxidised surfaces: thermal in ambient air and chemical with hydrogen peroxide. The diode characteristics have been investigated using dark and light current as f(v) measurements in the temperature range from 300 K to 380 K, from which it was possible to infer the electron barrier height. The data obtained show that the incorporation of a thin insulator layer between the semiconductor and the metal improves the performances of the devices by preventing the formation of suicides at the interface. Apart from that we also show that the MIS structures with the thermal oxide presents 'better' performances than the ones with the chemical oxide due to the type of interface states and of the oxide charges associated with the interface between the insulator and the semiconductor. © 1998 Elsevier Science B.V. All rights reserved.

We have developed a linear thin film position-sensitive detector with 128 elements, based on p.i.n. a-Si:H devices. The incorporation of this sensor into an optical inspection camera makes possible the acquisition of three-dimensional information of an object, using laser triangulation methods. The main advantages of this system, when compared with the conventional charge-coupled devices, are the low complexity of hardware and software used, and that the information can be continuously processed (analogic detection). In this paper, we present the most significant characteristics of the singular one-dimensional thin film position-sensitive detectors that form part of the linear array with 128 sensors. © 1998 Elsevier Science S.A.