Rodrigo Martins

This paper presents the process conditions that lead to the production of nanostructured silicon films grown by plasma enhanced chemical vapour deposition close to the so-called gamma regime (powder formation), highly dense and with low density of bulk states. Thus, the powder management is one important issue to be addressed in this paper. As a general rule we observed that high quality films (low density of states and high μτ products) are obtained when films are grown under low ion bombardment at high hydrogen dilution and deposition pressure conditions, to allow the proper surface passivation and surface activation.

Nanostructured silicon (na-Si:H) thin films were fabricated using plasma enhanced chemical vapour deposition (PECVD) technique under high silane hydrogen dilution and a discharge frequency of 27 MHz, where the substrate was located in the dark region of the plasma, protected by a grounded metal grid. By not exposing the growth surface directly to the plasma we avoid the silicon growth surface to sustain a high ion bombardment leading to a less defective surface and highly compact films. The intrinsic films grown under these conditions were used to produce the channel region of thin film transistors (TFTs) with a bottom gate staggered configuration, integrating different dielectric layers. The devices produced exhibit a field effect mobility close to 1.84 cm 2 V -1S -1, threshold voltage around 2 V, on/off ratio above 10 7 and sub-threshold slope below 0.5 V/decade, depending on the dielectric used. Copyright © 2010 American Scientific Publishers All rights reserved.

This paper reports the performance of small area solar cells, 128 linear integrated position sensitive detector arrays and thin film transistors based on nanostructured silicon thin films produced by plasma-enhanced chemical vapour deposition technique, close to the onset of dusty plasma conditions, within the transition region from amorphous to microcrystalline. The small area solar cells, produced in a modified single chamber reactor, exhibited very good electrical characteristics with a conversion efficiency exceeding 9%. The 128 integrated position sensitive detector arrays, based on a similar pin structure, allow real-time 3D object imaging with a resolution higher than 90 l p/mm. The thin film transistors produced exhibited field effect mobility of 2.47 cm 2/V/s, threshold voltage of 2 V, on/off ratio larger than 10 7 and sub-threshold slopes of 0.32 V/decade, which are amongst the best results reported for this type of device. © 2009 Taylor & Francis.

In this work, the optical and structural properties of high k materials such as tantalum oxide and titanium oxide were studied by spectroscopic ellipsometry, where a Tauc-Lorentz dispersion model based in one (amorphous films) or two oscillators (microcrystalline films) was used. The samples were deposited at room temperature by radio frequency magnetron sputtering and then annealed at temperatures from 100 to 500 °C. Concerning the tantalum oxide films, the increase of the annealing temperature, up to 500 °C does not change the amorphous nature of the films, increasing, however, their density. The same does not happen with the titanium oxide films that are microcrystalline, even when deposited at room temperature. Data concerning the use of a four-layer model based on one and two Tauc-Lorentz dispersions is also discussed, emphasizing its use for the detection of an amorphous incubation layer, normally present on microcrystalline films grown by sputtering. © 2006 Elsevier B.V. All rights reserved.

In this work, we show results concerning electro-optical properties, composition and morphology of nanocrystalline hydrogenated undoped silicon (nc-Si:H) films produced by hot wire plasma assisted chemical vapour deposition process (HWPA-CVD) and exhibiting a compact granular structure, as revealed by SEM micrographs. This was also inferred by infrared spectra, which does not present the SiO vibration band located at 1050-1200 cm-1, even when samples have long atmospheric exposition. The photoconductivity measured at room temperature also does not change when samples have a long time exposition to the air or to the light irradiation. The influence of hydrogen dilution on the properties of the films was also investigated.

The p/i interface plays a major role in the conversion efficiency of nanocrystalline silicon (nc-Si:H) solar cells. Under plasma-enhanced chemical vapor deposition (PECVD) of the intrinsic (i) nc-Si:H layer, ion bombardment can severely affect the underlying p-doped layer and degrade the solar cell performance. The core of the present work is to investigate the effect of light and heavy ion bombardment on the structural modifications of the p-layer during the p/i interface formation. The properties of the nc-Si:H materials deposited under distinct conditions are analyzed and correlated to the deposition rate and the resulting cell efficiency. To recreate the ion bombardment during the initial stages of the i-layer deposition on the p-layer, hydrogen plasma treatment was performed for 30 s (light ion bombardment), after which a flux of silane was introduced into the deposition chamber in order to initiate the heavy ion bombardment and growth of an ultra-thin (5 nm) i-layer. The structural changes of the p-type nc-Si:H layers were observed by spectroscopic ellipsometry. The obtained results confirm that detrimental structural modifications (e.g. partial amorphization of the sub-surface region and bulk) occur in the p-layer, caused by the ion bombardment. To minimize this effect, a protective buffer layer is investigated able to improve the performance of the solar cells fabricated under increased growth rate conditions. © 2015 Elsevier B.V. All rights reserved.

In this work we present data concerning the structure, composition and electro-optical performances of nanocrystalline silicon carbide doped films produced at the different filament temperatures and hydrogen dilution ratios. The XRD spectra reveal the presence of the typical Si peaks ascribed to (111) (220) and (311) diffraction planes, where no traces of the carbon peaks were found. The average grain sizes ranges from 10 nm to 30 nm, depending on the temperature of filament and hydrogen dilution used. We observed an enhancement of the peak ascribed to the (220) plane when high H dilution rates are used, meaning that the film starts being textured. The infrared data reveal the typical silicon carbide modes and a hydrogen content that varies from 3% to 1%, with the increase of the filament temperature. Besides that, the IR spectra show the typical SiO2 and SiO modes, associated to the oxide species that are mainly incorporated in the surface of the films and can be removed by proper wet etching. The planar conductivity is enhanced as the temperature of the filament is increased, being the highest conductivity achieved in the range of 0.2 (Ωcm)-1 and almost non activated. © 1998 Elsevier Science Ltd. All rights reserved.

We report in this paper the influence of the rf power on the properties of p-type silicon thin films produced by hot wire plasma assisted chemical vapor deposition (HWPA-CVD) technique, using a gas mixture containing SiH4, B2H6, CH4 and H2. The influence of the rf power in the film morphology, its structure and its composition has been determined by means of scanning electron microscopy (SEM), X-ray diffraction (XRD) and infrared spectroscopy. The electrical dark conductivity, activation energy, optical band gap and growth rate values for the different rf power was also evaluated. The data achieved show that rf power rules the surface morphology, the film structure and its electrical characteristics. © 2001 Elsevier Science B.V. All rights reserved.

The role of the deposition pressure (p) and the type of filaments (tungsten, W or tantalum, Ta) used to produce large area (10cm×10cm) n-type Si:H films by hot wire chemical vapour (HW-CVD) deposition technique was investigated. The data show that the electro-optical properties of the films produced are dependent on the gas pressure used. In the pressure range of 1×10-3 Torr to 1.0 Torr, the room dark conductivity (σd) varies from 1×10-8 to 2 S/cm for films produced at the same hydrogen dilution and filament temperature (Tfil). On the other hand, the hydrogen concentration (CH) decreases from 10% to 2%, while the growth rate (R) shows an exponential increase, from 1 to 9 Å/s. The SIMS analysis, within the detection limits, does not reveal the existence of any significant W or Ta contamination in the films produced.

This chapter gives an overview about GIZO TFTs, comprising an introductory section about generic TFT structure and operation, different semiconductor technologies for TFTs - with special emphasis on AOSs and particularly on GIZO - and then some experimental results obtained for GIZO TFTs fabricated in CENIMAT. Thin-film transistors (TFTs) are important electronic devices which are predominantly used as On/Off switches in active matrix backplanes of flat panel displays (FPDs), namely liquid crystal displays (LCDs) and organic light emitting device (OLED) displays. Even if a-Si:H is still dominating the TFT market in terms of semiconductor technology, oxide semiconductors are emerging as one of the most promising alternatives for the next generation of TFTs, bringing the possibility of having fully transparent devices, low processing temperature, low cost, high performance and electrically stable properties [1, 2]. Amorphous oxide semiconductors (AOS) such as Gallium-Indium-Zinc oxide (GIZO) [3, 4], even if fabricated at temperatures below 150°, are currently capable of providing transistors with field-effect mobility (μFE) exceeding 20 cm2V-1 s-1, threshold voltage (VT) close to 0V, On/Off ratios above 108, subthreshold swing (S) around 0:20V dec-1 and fully recoverable VT shift (ΔVT) lower than 0.5V after 24 h stress with constant drain current of 10 μA. © Springer-Verlag Berlin Heidelberg 2012.

In this work, we investigate the role of amorphous silicon (a-Si:H) thin films deposited by a plasma enhanced chemical vapor deposition (PECVD) technique on porous silicon (PS) to facilitate its water vapor and oxygen gas sensing properties using its electrical response. Overall we notice a rectifying behavior from a-Si:H/PS heterojunction device, where a current enhancement of one and four orders of magnitude was observed in the presence of oxygen gas and water vapor, in comparison with atmospheric air at room temperature, respectively. The photoluminescence (PL) investigation of PS shows a slight blue shift in the PL emission band from 1.72 to 1.77 eV and the intensity of the PL is enhanced by a factor of 5.4 with increase of porosity from 21% to 77%. This PL emission may originate from the O-Si-H related absorbance bands. Alternatively, quenching of the PL intensity was observed after a-Si:H films were deposited on PS specimens. Besides, micro-Raman and atomic force microscopic (AFM) analyse were carried out to understand the structure and morphological features of the PS and a-Si:H/PS specimens. © 2007 Elsevier B.V. All rights reserved.