Rodrigo Martins

In this work we investigate the properties of a polymorphous silicon (pm-Si:H) metal-insulator-semiconductor (MIS) structure used in 3D position sensitive detectors (PSD). For the first time a 3D sensor made-up by pm-Si:H/SiO2/Au layers is presented. MIS structures present several advantages over p-i-n structures, such as easier fabrication, fast response time and higher resolution. The 1D MIS PSD that constitute the array were extensively studied aiming its application in 3D pattern recognition. The results obtained show that MIS PSD can achieve non-linearities below 2% and sensitivities of 3.2 μA/cm over 6 mm length sensors. The miniaturization of the sensors length to arrays of 6 and 16 mm, respectively showed average non-linearities of about 1.9% for the 16 mm sensor which proved to be the best solution for this MIS structure. © 2006 Elsevier B.V. All rights reserved.

In this work, we study the electro-optical behaviour of cellulose/liquid crystal-based composite systems, in particular the influence of the flexible substrates and its conductive layers in the electro-optical behaviour of these kind of cells. Four cells were made using, respectively, two different substrates (a flexible polymer (poly(ethylene terephthalate) (PET)) and a soda lime glass) and two different conductive layers (indium tin oxide (ITO) and aluminium zinc oxide (AZO)). The conductive layer (AZO) was deposited in both, flexible and rigid substrates, for the same conditions, and the same substrates coated with ITO are commercially available. The cells were prepared from solid films of hydroxypropylcellulose (HPC) (30 μm thick) cross linked with 1,4-diisocyanatobutane (BDI) (7% w/w) and the nematic liquid crystal E7 (Merck, UK). The four different substrates were electrically and morphologically characterised. We have analysed all samples by light transmission and determined the maximum transmission, contrast and Von. We show a comparison of the results obtained for both flexible and rigid cells and discuss them in terms of the proposed working mechanism for these systems. © 2002 Elsevier Science B.V. All rights reserved.

In order to correlate the MIS devices performance with different surface oxidation methods, AFM, spectroscopic ellipsometry and infrared spectroscopy measurements were performed in a-Si:H films, before and after surface oxidation, using different oxidation techniques and oxides: thermal dry (in air), wet (in H2O2) and by oxygen plasma, while MIS (metal-insulator-semiconductor) devices were characterized by I-V curves, under dark and AM1.5 illumination conditions. The a-Si:H films were grown by the PECVD technique, in a modified triode configuration reactor to allow a precise control of the ion bombardment during the film deposition. We found that the growth of a thin layer of oxide by chemical processes on the top of the a-Si:H surface can cause changes on the surface morphology that are reflected in the electrical behaviour of the devices. The oxygen plasma treatment, cause the rearrangement of the surface atoms leading to a change of their morphology and to the improvement of the electrical properties of the surface for a MIS applications.

In order to understand the kinetics of formation of interface/surface states and its correlation on the final device performance, a preliminary study was performed on MIS structures, before and after surface oxidation/passivation, using different oxidation techniques and oxides: thermal (in air), chemical (in H2O2) and oxygen plasma. The devices used in this work are based on a glass/Cr/a-Si:H(n+)/a-Si:H(i)/SiOx/Pd structures, where the amorphous silicon intrinsic layer (i a-Si:H) with a photosensitivity of 107 was deposited by a modified plasma enhanced chemical vapour deposition (PECVD) triode system. The electrical properties of a-Si:H MIS structures were investigated by measuring their diode current-voltage characteristics in the dark and under illumination as well as the spectral response, as a function of the various oxidation techniques. Infrared spectroscopy and spectroscopic ellipsometry were used as a complementary tool to characterise the oxidised surface.

In this work we present results of a study performed on MIS diodes with the following structure: substrate (glass) / Cr (2000Å) / a-Si:H n + (400Å) / a-Si:H i (5500Å) / oxide (0-40Å) / Au (100Å) to determine the influence of the oxide passivation layer grown by different techniques on the electrical performance of MIS devices. The results achieved show that the diodes with oxides grown using hydrogen peroxide present higher rectification factor (2×106) and signal to noise (S/N) ratio (1×107 at -1V) than the diodes with oxides obtained by the evaporation of SiO2, or by the chemical deposition of SiO 2 by plasma of HMDSO (hexamethyldisiloxane), but in the case of deposited oxides, the breakdown voltage is higher, 30V instead of 3-10 V for grown oxides. The ideal oxide thickness, determined by spectroscopic ellipsometry, is dependent on the method used to grow the oxide layer and is in the range between 6 and 20 Å. The reason for this variation is related to the degree of compactation of the oxide produced, which is not relevant for applications of the diodes in the range of ± 1V, but is relevant when high breakdown voltages are required.

In this study, amorphous indium-tungsten oxide (IWO) semiconductor thin films were prepared by an eco-friendly spin-coating process using ethanol and water as solvents. The electrical properties of IWO thin-film transistors (TFTs), together with the structural and morphological characteristics of IWO thin films, were systematically investigated as functions of tungsten concentration and annealing temperature. The optimized IWO channel layer was then integrated on an aqueous aluminum oxide (AlOx) gate dielectric. It is observed that the solution-processed IWO/AlOx TFT presents high stability and improved characteristics, such as an on/off current ratio of 5 × 107, a field-effect mobility of 15.3 cm2 V-1 s-1, a small subthreshold slope of 68 mV dec-1, and a threshold voltage shift of 0.15 V under bias stress for 2 h. The IWO/AlOx TFT could be operated at a low voltage of 2 V, which was 15 times lower than that of conventional SiO2-based devices. The solution-processed IWO thin films synthesized in a green route would be promising candidates for large-area and high-performance low-cost devices. © The Royal Society of Chemistry 2016.

This work presents a study on the effect of an interfacial silicon oxide layer placed between Au and a-Si:H MIS (metal-insulator-semiconductor) photodiodes in their performances, by stopping the Au diffusion towards the a-Si:H. The results show that the Au diffuses very easily to the oxide free a-Si:H surface, even at room temperature, degrading the photodiode performance. On the other hand, the MIS photodiodes with the interfacial oxide show an improvement of their characteristics after annealing, function of its thickness, and degree of film's compactness. This effect is associated with the presence of oxide of thicknesses ≥5 Å at the Au/a-Si:H interface that prevents the Au diffusion and improves the photodiode characteristics, which does not happen when the interfacial oxide is absent. © 2004 Elsevier B.V. All rights reserved.

This work presents a study performed on several Au contacts deposited by evaporation on oxide free and oxidised (5-20Å of oxide) a-Si:H surfaces. The characterisation of the films was performed on as deposited, aged and annealed at 150°C structures. SIMS and RBS measurements show that the Au diffuses very easily on oxide free a-Si:H surfaces, even at room temperature, resulting in the formation of an oxide at the device surface that acquires a blue colour instead of the gold colour of the contacts. This was also visible in the SEM pictures of the cross section of the structures produced and on the changes of the surface morphology observed by AFM measurements. On the other hand, when the Au is deposited on oxidised a-Si:H surfaces, the results show that the oxide prevents the Au from diffusing and the nature of the contact is preserved. That is, better rectifying and stability performances are obtained in MIS like structures than in Schottky structures.

This work presents a study performed on the deposition of pm-Si:H by plasma enhanced chemical vapor deposition using excitation frequencies of 13.56 and 27.12 MHz, where the interest of increasing the excitation frequency relies on higher plasma dissociation and reduced energy of ion bombardment, thus allowing the deposition of superior grade material at higher growth rates. The plasma impedance, which allows the monitoring of particle formation in the plasma, was correlated to the film properties, characterized by spectroscopic ellipsometry and hydrogen exodiffusion experiments. The set of data obtained show that by using the 27.12-MHz excitation frequency the hydrogen dilution and the r.f. power density needed to produce pm-Si:H can be reduced. Growth rates above 3.1 Å/s were obtained, the films being more dense and chemically more stable than those obtained with the standard 13.56 MHz. © 2003 Elsevier B.V. All rights reserved.

It is experimentally known that the linearity and sensitivity of the position sensitive detectors (PSD) are dependent on the resistance of the collecting layer and of the load resistance, mainly if the detection is based on the measurement of the photo-lateral voltage. To determine the value of the load resistance to be used in metal - insulator - semiconductor (MIS) PSDs structures that lead to the maximum value of sensitivity and linearity, we propose an electrical model through which it is able to simulate the proper sensor response and how the load resistance influence the results obtained. This model is valid for PSDs where the resistance of the collecting resistive layer is quite low (≤ 500 Ω), leading to a low output impedance. Under these conditions we conclude that the value of the load resistance should be of about 1 kΩ in order to achieve a good compromise between the linearity and the sensitivity of the PSD. This result is in agreement with the set of experiments performed. © 2005 Materials Research Society.

In this work metal-insulator-semiconductor (MIS) photodiodes with a structure: Cr/a-Si:H(n+)/a-Si:H(i)/oxide/Au were studied, where the main objective was to determine the influence of the oxide layer on the performance of the devices. The results achieved show that their performance is a function of both oxide thickness and oxide density. The a-Si:H oxidation method used was the immersion in H2O2 solution. By knowledge of the oxide growth process it was possible to fabricate photodiodes exhibiting an open circuit voltage of 0.65V and short circuit current density under AM1.5 illumination of 11mA/cm2, with a response times less than 1μs for load resistance <400Ω, and a signal to noise ratio of 1×107. © 2003 Elsevier B.V. All rights reserved.

In this work we present results of a study performed on metal-insulator-semiconductor (MIS) diodes with the following structure: substrate (glass)/Cr (2000 Å)/a-Si:H n+(400 Å)/a-Si:H i (5500 Å)/oxide (0-40 Å)/Au (100 Å) to determine the influence of the oxide passivation layer grown by different techniques on the electrical performance of MIS devices. The results achieved show that the diodes with oxides grown using hydrogen peroxide present higher rectification factor (2×106) and signal to noise (S/N) ratio (1×10 7 at -1 V) than the diodes with oxides obtained by the evaporation of SiO2, or by the chemical deposition of SiO2 by plasma of hexamethyldisiloxane. However, in the case of deposited oxides, the breakdown voltage is higher, 30 V instead of 3-10 V for grown oxides. The ideal oxide thickness, determined by spectroscopic ellipsometry, is dependent on the method used to grow the oxide layer and is in the range between 6 and 20 Å. The reason for this variation is related to the degree of compactation of the oxide produced, which is not relevant for applications of the diodes in the range of ±1 V, but is relevant when high breakdown voltages are required. © 2003 Elsevier B.V. All rights reserved.

This work presents a fast method to determine qualitatively the uniformity and the thickness of transparent or semitransparent thin films in the visible to near-infrared region. The method proposed is based on the information recorded by a colour scanner in the form of coloured regions, due to the constructive interferences caused by multibeam wavelength light sources as function of the film thickness and refractive index. The method is well applied in transparent films, where the uniformity cannot be seen by visual inspection. This paper shows that the results obtained for ZrO2 films are satisfactory enabling the application of this technique to determine the films uniformity in fast and cheap way.

The present work is focused on gelatin-based electrolytes doped with a range of concentration of zinc triflate (Zn(CF3SO3)2). The transparent-thin-film samples have been represented by the notation GelatinnZn(CF3SO3)2, where n represents the zinc triflate salt concentration in the electrolyte membranes from 0.00 wt% to 10.93 wt% The samples have been characterized by conductivity measurements, thermal analysis, cyclic voltammetry, X-ray diffraction (XRD), polarized optical microscopy (POM) and scanning electron microscopy (SEM). The gelatin-based electrolytes were also tested as ionic conductors in electrochromic devices with the glass/ITO/WO3/gelatin-based electrolyte/CeO2-TiO2/ITO/glass configuration. © 2013 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.

This work presents the I-V results of a-Si:H/SiOx/Pd MIS (metal-insulator-semiconductor) structures. The a-Si:H was deposited by non-conventional modified triode PECVD. This new configuration allows the deposition of high quality a-Si:H with a photosensitivity of 106, indicating the presence of low density of defects. Spectroscopic ellipsometry measurements revealed that these films are highly dense and present a very smooth surface so allowing a low defect interface between the Pd and the a-Si:H. As a result, we could make MIS photodiodes with barrier heights of 1.17 eV, which give a high reduction of the reverse dark current, an increase of the signal to noise ratio of 106 and an open circuit voltage VOC = 0.5 V. © 2002 Elsevier Science B.V. All rights reserved.

Although there are a few research studies on solution-processed p-channel oxide thin-film transistors (TFTs), the strict fabrication conditions and the poor electrical properties have limited their applications in low-power complementary metal oxide semiconductor (CMOS) electronics. Here, the application of the polyol reduction method for processing p-type CuxO and NiOx channel layers and their implementation in TFT devices are reported. The optimized CuxO and NiOx TFTs were achieved at low annealing temperatures (∼300 °C) and exhibited decent electrical properties. Encouraged by the inspiring results obtained on SiO2/Si substrates, the TFT performance was further optimized by device engineering, employing high-k AlOx as the gate dielectric. The fully solution-processed NiOx/AlOx TFT could be operated at a low voltage of 3.5 V and exhibits a high hole mobility of around 25 cm2 V-1 s-1. Our work demonstrates the ability to grow high-quality p-type oxide films and devices via the polyol reduction method over large area substrates while at the same time it provides guidelines for further p-type oxide material and device improvements. © The Royal Society of Chemistry 2016.

In this work a new structure is proposed for position sensitive detectors consisting of glass/Cr/aSi:H(n+)/a-Si:H(i)/ZnO, where the ZnO forms an heterojunction with the a-Si:H(i). The results show that this structure works with success in the fabrication of linear position sensitive detectors. The devices present a good nonlinearity of ≈ 2% and a good sensitivity to the light intensity. The main advantages of this structure over the classical p-i-n are an easier to built topology and a higher yield due to a better immunity to the a-Si:H pinholes, since the ZnO does not diffuse so easily into a-Si:H as the metal does, which are the cause of frequent failure in the p-i-n devices due to short-circuits caused by the deposition of the metal over the a-Si:H. In this structure the illumination is made directly on the ZnO, so a transparent substrate is not needed and a larger range of substrates can be used.

In this work we show that it is possible to control the plasma regime in the region close to the substrate in r.f. silane discharges. The PECVD reactor works in a modified triode configuration, where the control over the plasma regime is performed by polarising a grid electrode, placed close to the r.f. electrode, with a DC power source. Besides that, the DC grid allows also to control the energy of the ion bombardment, because the plasma potential will be a function of the voltage (Vpol) applied to the DC grid. The silane plasma was characterised with a Langmuir probe and an impedance probe. We were able to identify three plasma regimes in the region close to the substrate: γ′ regime for Vpol<0 V; γ′-α regime for 0 V<Vpol<40 V; and α regime for Vpol40 V. The γ′ regime is associated with a high concentration of dust particles in plasma and high electron energy (≈8eV), while the α regime is associated with a free dust plasma and low electron energy (≈2eV). The intermediate regime, γ′-α, is characterised by the presence of smaller particles (≈2-5nm) that can be beneficial for the film's properties. © 2002 Elsevier Science Ltd. All rights reserved.

Highly conducting and transparent gallium doped zinc oxide thin films have been deposited at high growth rates by r.f. magnetron sputtering at room temperature on inexpensive soda lime glass substrates. The argon sputtering pressure was varied between 0.15 and 2.1 Pa. The lowest resistivity was 2.6 × 10-4 Ω cm (sheet resistance ≈6 Ω/sq. for a thickness ≈600 nm) and was obtained at an argon sputtering pressure of 0.15 Pa and a r.f. power of 175 W. The films present an overall transmittance in the visible spectra of approximately 90%. The increase on the resistivity for higher sputtering pressures is due to a decrease of both, mobility and carrier concentration, and is associated to a change on the surface morphology. The low resistivity, accomplished with a high growth rate (290 Å/min) and with a room temperature deposition enables these films deposition onto polymeric substrates for flexible optoelectronic devices. © 2002 Elsevier Science B.V. All rights reserved.

In this work we show that it is possible to control the plasma species present near the substrate surface, from what is usually associated with an α regime (a plasma free of particles) to a γ' regime (a plasma where particles are present) and simultaneously control the energy of the ions striking the substrate during a-Si:H deposition from a silane glow discharge in a modified triode (MT) type PECVD reactor, where a DC mesh electrode biased with Vpol is located in front of the r.f electrode. The presence of large particles in the plasma leads to the deposition of the films with the poorest optoelectronic properties. When the particle size in the plasma decrease the film properties improve, but, when particles are no longer present in the plasma region close to the substrate, like in a α like regime, the properties of the films deteriorate again. The results show that the best transport properties are achieved for the films deposited in the α-γ' transition regime corresponding to 0V<Vpol<51V. Under this condition the films present a dark conductivity, σ d ≈ 10-11 (Ωcm)-1, photosensitivity, S ≈ 107, activation energy, ΔE ≈ 0.9 eV, hydrogen content, CH ≈ 10%, factor of microstructure, R ≈ 0.085 and an optical gap, Eop ≈ 1.77 eV.

{In this work we report how it is possible to control the plasma regime near the substrate surface, from predominantly α to predominantly γ', passing trough and intermediate α-γ' regime, and simultaneously control the energy of the ions striking the substrate during a-Si:H deposition from a silane glow discharge in a modified triode type PECVD reactor. To do so, we apply a DC voltage (Vpol to a set of grids placed in front of the r.f. electrode and by doing this, we control the energy of the ions striking the substrate during the film's growth and the plasma regime near the substrate. Under a plasma of the γ' regime, the surface roughness is high and the films are poorly compact. In the α-γ' regime, the ion bombardment is moderate and the films are highly smooth and compact. In the α regime the ion bombardment is higher and so the films can become more compact but the surface roughness increases and the electrical properties deteriorate. The results achieved show that the best transport properties are achieved for the films deposited in the α-γ' regime corresponding to a Vpol of 38 V. Under this condition the films presented a dark conductivity, σd = 6.2×10-12 (Ωcm)-1, activation energy, ΔE ≈ 0.9 eV, hydrogen content

Metal nanoparticles are of great interest for light trapping in photovoltaics. They are usually incorporated in the rear electrode of solar cells, providing strong light scattering at their surface plasmon resonances. In most cases, the nanoparticles are self-assembled by solid-state dewetting over a transparent conductive oxide (TCO) layer incorporated in the cell's rear electrode. Up to now, this process has been optimized mainly by tuning the thermal annealing parameters responsible for dewetting, or the thickness of the precursor metallic layer; but little attention has been paid to the influence of the underlying TCO layer properties on the morphology of the nanoparticles formed, which is the focus of the present article. This work investigates Ag nanoparticles structures produced on distinct surfaces by a simple, fast and highly reproducible method employing rapid thermal annealing. The results indicate that both the thermal conductivity and surface roughness of the TCO layer play a determinant role on the morphology of the nanostructures formed. This is of particular relevance, since we show in the study performed that the parasitic absorption of these Ag nanostructures is reduced, while the scattering is enhanced when the Ag nanostructures are formed on TCO layers with the highest conductivity and the lowest surface roughness (∼1 nm). These results unveil novel possibilities for the improvement of plasmonic nanostructures fabricated by thermal dewetting, via the careful adjustment of the physical properties of the underlying surface. © 2016 American Chemical Society.

This paper presents the results achieved in optimized 1D position sensitive detectors (PSD) using a metal-insulator-semiconductor (MIS) structure and different length to width ratios, in order to determine the optimal geometrical factor for the desired 3D integration. The results show that the optimized MIS PSD produced, exhibited linearity errors as low as 0.8% and sensitivities of 32 mV/cm, for a 5 mW spot beam intensity at a wavelength of 532 nm. The sensors can achieve a longitudinal spatial resolution of 1.25 μm (estimated by modulation transfer function calculation), while the transverse resolution depends on the minimum width used for each sensor. The calculated Jones parameter of the sensors is higher than 1011 J, with a fall-off parameter of 0.012 cm-1, indicating a high signal to noise detection ratio. © 2006 Elsevier B.V. All rights reserved.

This work presents for the first time a study on the deposition of polymorphous silicon at an excitation frequency of 27.12 MHz in a large-area plasma enhanced chemical vapor deposition (PECVD) reactor. Moreover, the films produced at 13.56 MHz were also investigated to compare their performance with that of the films produced at 27.12 MHz. The SiH4/H2 plasma was characterized by impedance probe measurements, aiming to identify the plasma conditions that lead to produce polymorphous films, under quasi-isothermal conditions. The films were characterized by spectroscopic ellipsometry, infrared absorption, Raman spectroscopy, and hydrogen exodiffusion experiments. These techniques enable a detailed structural characterization of the polymorphous films and a study of the differences between the films deposited at 27.12 MHz and 13.56 MHz. Conductivity measurements were also performed to determine the transport properties of the films. The results show that by using a 27.12 MHz frequency, the growth rate increased by 70% and a more stable, relaxed and denser structure was obtained.

The linearity and sensitivity of linear Position Sensitive Detectors (PSD) are the two principal characteristics of sensors to be optimised in sensor fabrication. This work presents several efforts made to understand the internal and external parameters that influence the linearity and sensitivity of Metal Insulator Semiconductor (MIS) linear PSD with an active length of 6 cm. The use of long sensitive areas allows the PSD to achieve greater resolution without the need of a highly accurate light spot integration mechanism. The PSD is built in a multi-layered structure consisting of Cr/a-Si:H (n+ doped)/a-Si:H (intrinsic)/SiOx (passivation layer)/Au, where the active a-Si:H layers were deposited by Modified Triode Plasma Enhanced Chemical Vapour Deposition (MTPECVD), which allows the deposition of good electronic grade material with a low (≈ 1 × 1015 cm-3) defect density inferred by CPM. The sensor linearity and sensitivity shows dependence on the sensor width to length ratio, SiOx layer and on the value of the load resistance. Sensitivities of more than 30 mV/cm were achieved with linearity near 99%. Besides that, this type of MIS structure allows an improved spectral response in the near-UV region and has its maximum response at 540 nm. © 2005 Springer Science + Business Media, Inc.