Rodrigo Martins

We report here about a computer simulation program, based on a comprehensive physical and numerical model of an a/μc-Si:H p-i-n device, applied to the 2D problem of describing the transport properties within the structure under non- uniform illumination. The continuity equations for holes and electrons together with Poisson's equation are solved simultaneously along the two directions parallel and perpendicular to the junction. The basic semiconductor equations are implemented with a recombination mechanism reflecting the microcrystalline structure of the different layers. The lateral effects occurring within the structure, due to the non-uniformity of the radiation are outlined. The simulation results obtained for different wavelengths of the incident light are compared and shown their dependence on the energy of the radiation. The results of simulating a p-i-n μc-Si:H junctions under non-uniform illumination is that the generated lateral effects depend not only in intensity but also in direction on the wavelength of the incident radiation. ©2004 Copyright SPIE - The International Society for Optical Engineering.

This work presents preliminary results in the study of a novel structure for a laser scanned photodiode (LSP) type of image sensor. In order to increase the signal output, a stacked p-i-n-p-i-n structure with an intermediate light-blocking layer is used. The image and the scanning beam are incident through opposite sides of the sensor and their absorption is kept in separate junctions by an intermediate light-blocking layer. As in the usual LSP structure the scanning beam-induced photocurrent is dependent on the local illumination conditions of the image. The main difference between the two structures arises from the fact that in this new structure the image and the scanner have different optical paths leading to an increase in the photocurrent when the scanning beam is incident on a region illuminated on the image side of the sensor, while a decreasing in the photocurrent was observed in the single junction LSP. The results show that the structure can be successfully used as an image sensor even though some optimization is needed to enhance the performance of the device. © 2004 Elsevier B.V. All rights reserved.

Here we describe an innovative optoelectronic platform which enables the specific detection of unamplified nucleic acid sequences with the integration of oligonucleotide-derivatized gold nanoparticles, a colour sensor and a light emission source for a colorimetric detection method. This new low cost, fast and simple optoelectronic platform permits detection of less than 1 picomole quantities of nucleic acid without target or signal amplification. ©2007 IEEE.

Total hip replacement is a common practice in every day clinical work. Artificial hip implants consist of a femoral component and an acetabular component. Nowadays the acetabular component is composed of a polymeric cup and a metallic shell. This study focuses the development of an innovative acetabular component substituting the metallic shell by a multilayer coating on the acetabular cup. A titanium coating was deposited onto ultra-high molecular weight polyethylene (UHMWPE) samples by physical vapour deposition (PVD), having an in situ pre-treatment with argon ion bombardment in order to optimize the adhesive strength by surface modification, followed by the deposition of a thin film of hydroxyapatite (HA) using rf magnetron sputtering technique, at room temperature. Results obtained seem to indicate that these multilayer coatings can be a viable alternative to the metallic shell, leading to the substitution of a two part for a one part acetabular component.

A novel linear analog adder is proposed only with n-type enhancement IGZO TFTs that computes summation of four voltage signals. However, this design can be easily extended to perform summation of higher number of signals, just by adding a single TFT for each additional signal in the input block. The circuit needs few number of transistors, only a single power supply irrespective of the number of voltage signals to be added, and offers good accuracy over a reasonable range of input values. The circuit was fabricated on glass substrate with the annealing temperature not exceeding 200° C. The circuit performance is characterized from measurements under normal ambient at room temperature, with a power supply voltage of 12 V and a load of ≈ 4 pF. The designed circuit has shown a linearity error of 2.3% (until input signal peak to peak value is 2 V), a power consumption of 78 μW and a bandwidth of ≈ 115 kHz, under the worst case condition (when it is adding four signals with the same frequency). In this test setup, it has been noticed that the second harmonic is 32 dB below the fundamental frequency component. This circuit could offer an economic alternative to the conventional approaches, being an important contribution to increase the functionality of large area flexible electronics. © 2016 IEEE.

This work focuses on the role of the native oxide layer (SiO2) on the nickel (Ni)-assisted crystallization of amorphous silicon (a-Si). In some samples, the native oxide was removed using a HF-diluted solution before Ni layers with 0.5 nm be deposited on a-Si. The results show that the presence of a thin SiO2 layer of about 3 nm between the a-Si and the Ni delays the crystallization process. Ellipsometry data show that, after annealing for 5 h at 500 °C, the HF-cleaned sample presents a crystalline fraction of 88%, while the one with the native oxide has only 35%. This difference disappears after 20 h where both samples present similar crystalline fraction. These facts are also reflected on the film's electrical properties, where the activation energy for samples annealed for 5 h rises from 0.42 eV to 0.55 eV, when the oxide layer is removed. After 20 h and 30 h, the activation energy is around 0.55 eV for both kinds of samples, meaning that films with similar electrical properties are now obtained. However, the XRD data suggest the presence of some structural differences attributed to slight differences on the crystallization process. © 2005 Elsevier B.V. All rights reserved.

Thin films of indium molybdenum oxide (IMO) were rf sputtered onto glass substrates at room temperature. The films were studied as a function of sputtering power (ranging 40-180 W) and sputtering time (ranging 2.5-20 min). Thickness of the films found varied between 50-400 nm. The films were characterized for their structural (XRD), electrical (Hall measurements) and optical (Transmittance spectra) properties. XRD studies revealed that the films are amorphous for the sputtering power ≤ 100 W and deposition time ≤ 5 min. All the other films are polycrystalline and the strongest refection along (222) plane showing a preferential orientation. A minimum bulk resistivity of 2.65 × 10-3 Ω-cm and a maximum carrier concentration of 4.16 × 1020 cm-3 have been obtained for the films sputtered at 180 W (10 min). Whereas maximum mobility (19.5 cm2 V-1 s-1) has been obtained for the films sputtered at 80 W (10 min). A maximum visible transmittance of 90% (500 nm) has been obtained for the films sputtered at 80 W (10 min) with a minimum of 27% for those sputtered at 180 W. The optical band gap of the films found varying between 3.75 and 3.90 eV for various sputtering parameters. © 2006 Materials Research Society.

We report high performance ZnO thin film transistor (ZnO-TFT) fabricated by rf magnetron sputtering at room temperature with a bottom gate configuration. The ZnO-TFT operates in the enhancement mode with a threshold voltage of 19 V, a field effect mobility of 28 cm2/Vs, a gate voltage swing of 1.39 V/decade and an on/off ratio of 3×105. The ZnO-TFT present an average optical transmission (including the glass substrate) of 80% in the visible part of the spectrum. The combination of transparency, high field-effect mobility and room temperature processing makes the ZnO-TFT a very promising low cost optoelectronic device for the next generation of invisible and flexible electronics.

UV-enhanced monocrystalline zinc sulphide optical sensors with high quantum efficiency have been developed by spray deposition of heavy fluorine-doped tin oxide (FTO) thin films onto the surface of zinc sulphide monocrystals as an alternative to the UV-enhanced high-efficiency silicon photodetectors commonly used in precise radiometric and spectroscopic measurements as well as to new sensors based on SiC and GaN. The fabricated sensors have an unbiased internal quantum efficiency that is nearly 100% from 250 to 320 nm, and the typical sensitivity at 250 nm is 0.15 A W-1. The sensors are insensitive to solar radiation in conditions on the earth and can be used as solar blind photodetectors for precision UV measurements under direct solar illumination for both terrestrial and space applications. © 1998 Elsevier Science S.A. All rights reserved.

UV-enhanced monocrystalline zinc sulphide optical sensors with high quantum efficiency have been developed by spray deposition of heavy fluorine-doped tin oxide (FTO) thin films onto the surface of zinc sulphide monocrystals as an alternative to the UV-enhanced high-efficiency silicon photodetectors commonly used in precise radiometric and spectroscopic measurements as well as to new sensors based on SiC and GaN. The fabricated sensors have an unbiased internal quantum efficiency that is nearly 100% from 250 to 320 nm, and the typical sensitivity at 250 nm is 0.15 A W-1. The sensors are insensitive to solar radiation in conditions on the earth and can be used as solar blind photodetectors for precision UV measurements under direct solar illumination for both terrestrial and space applications.

In this paper we report on large area one dimensional (1D) amorphous silicon position sensors deposited on flexible polymer foil substrate. The pin sensor structure was deposited by rf plasma enhanced chemical vapour deposition (PECVD). For the electrical and optical characterisation the sensors have been mounted on a convex holder with a 14-mm radius-of-curvature, since the main goal of this work is to develop a flexible position sensor to be incorporated in a micromotor in order to measure its angular velocity continuously. The obtained sensors present adequate performances concerning the position non-linearity (±1% in 20 mm length), comparable to those fabricated on glass substrates. © 2000 Elsevier Science B.V. All rights reserved.

In this paper the influence of the DC grid bias on the plasma impedance and the I-V behaviour of silane plasmas used to grow undoped amorphous silicon films by plasma enhanced chemical vapour deposition technique using a triode configuration at or close to the powder regime is studied. The aim is to determine the correlation between the r.f. power and the DC grid voltage with the plasma parameters, under isothermal gas conditions. The results should lead to the production of nanostructured films, with the required optoelectronic characteristics for photovoltaic applications. The results achieved show the existence of a boundary region close to the γ-regime (powder formed) where nanoparticles can be formed by moderated ion bombardment of the growing surface. This is characterised by the plasma resistance of the same order of magnitude of the plasma reactance. Under this condition, it is possible to grow amorphous silicon films that can incorporate nanoparticles, exhibiting photosensitivities of about 107 (two orders of magnitude larger than the one exhibited by films grown under conventional conditions) with densities of states determined by the constant photocurrent method below 3 × 1015 cm3. Apart from that, the growth of the films is less affected by light soaking than the conventional films grown by standard techniques. © 2001 Elsevier Science Ltd. All rights reserved.

The aim of this paper is to present results on a new soldering process based on the low-temperature solidification of intermetallic phases from the system Cu-Sn-Cu which can be employed to form a heat-resistant die-attach as well as signal and power electric contacts. Because of the total transformation into intermetallic phase, the working temperature of the bond formed is several hundred degrees Celsius higher than the process temperature (around 250°C). This process leads to a homologous temperature T/Tm of about 0.3 compared to 0.7 in the case of soft SnAg solder alloy. Therefore a better reliability of the proposed bonding process is achievable. Results of the match of the predicted volume fraction of the intermetallic forms and the experimentally measured contact volume would be also discussed, for contacts formed in power diodes.

Large-area thin-film position-sensitive detectors (TFPSDs) using the hydrogenated amorphous silicon (a-Si:H) technology are presented. The detection accuracy of these devices (lengths of about 80 mm) is better than ±0.5% of the value of the full scale of the sensor, the spatial resolution is better than ±20 μm, the non-linearities measured are below ±2% and the frequency response is in the range of a few kilohertz, compatible with the sampling frequency of most electromechanical assembling/control systems. The obtained results are quite promising regarding the application of these sensors to a wide variety of optical inspection systems. © 1998 Elsevier Science S.A. All rights reserved.

Large-area thin-film position-sensitive detectors (TFPSDs) using the hydrogenated amorphous silicon (a-Si:H) technology are presented. The detection accuracy of these devices (lengths of about 80 mm) is better than ±0.5% of the value of the full scale of the sensor, the spatial resolution is better than ±20 μm, the non-linearities measured are below ±2% and the frequency response is in the range of a few kilohertz, compatible with the sampling frequency of most electromechanical assembling/control systems. The obtained results are quite promising regarding the application of these sensors to a wide variety of optical inspection systems.

A Linear array Thin Film Position Sensitive Detector (LTFPSD) based on hydrogenated amorphous silicon (a-Si:H) is proposed for the first time, taking advantage of the optical properties presented by a-Si:H devices we have developed a LTFPSD with 128 integrated elements able to be used in 3D inspections/measurements. Each element consists on an one-dimensional TFPSD, based on a p.i.n. diode produced in a conventional PECVD system, where the doped layers are coated with thin resistive layers to establish the required device equipotentials. By proper incorporation of the LTFPSD into an optical inspection camera it will be possible to acquire information about an object/surface, through the optical cross-section method. The main advantages of this system, when compared with the conventional CCDs, are the low complexity of hardware and software used and that the information can be continuously processed (analogue detection).

In this paper we present an improved version of large area (5 mm × 80 mm) flexible position sensitive detectors deposited on polyimide (Kapton® VN) substrates with 75 μm thickness, produced by plasma enhanced chemical vapor deposition (PECVD). The structures presented by the sensors are Kapton/ZnO:Al/(pin)a-Si:H/Al and the heterostructure Kapton/Cr/(in)a-Si:H/ZnO:Al. These sensors were characterized by spectral response, photocurrent dependence as a function of light intensity and position detectability measurements. The set of data obtained on one-dimensional position sensitive detectors based on the heterostructure show excellent performances with a maximum spectral response of 0.12 A/W at 500 nm and a non-linearity of ±10%. © 2002 Elsevier Science B.V. All rights reserved.

A new high quantum efficiency gallium phosphide Schottky photodiode has been developed by spray deposition of heavily doped tin oxide films on n-type epitaxial structures, as an alternative to the conventional Schottky photodiodes using a semitransparent gold electrode. It is shown that fluorine-doped tin oxide films are more effective as transparent electrodes than tin-doped indium oxide films. The proposed photodiodes have a typical responsivity near 0.33 A W-1 at 440 nm and an unbiased internal quantum efficiency close to 100%, in the range from 250 to 450 nm. The model used to calculate the internal quantum efficiency (based on the optical constants of tin oxide films and gallium phosphide epitaxial layers) is found to be in good agreement with the experimental results. The data show that the quantum efficiency is strongly dependent on the thickness of the transparent electrode, owing to optical interference effects. The noise equivalent power for 440 nm is 2.7 × 10-15 W Hz-1/2, which indicates that these photodiodes can be used for accurate measurements in the short-wavelength range, even in the presence of stronger infrared background radiation.

In this article we review the recent progress in n- and p-type oxide based thin film transistors (TFT), with special emphasis to solution-processed and p-type, and we will summarize the major milestones already achieved with this emerging and very promising technology.

Gallium-doped zinc oxide (GZO) thin films have been deposited onto polyethylene naphthalate (PEN) substrates by r.f. magnetron sputtering at room temperature. The influence of the film thickness (from 70 to 890 nm) on the electrical, structural and morphological properties are presented. The lowest resistivity obtained was 5 × 10-4 Ω cm with a Hall mobility of 13.7 cm2/Vs and a carrier concentration of 8.6 × 1020 cm-3. These values were obtained by passivating the surface of the polymer with a thin silicon dioxide, so preventing the moisture and oxygen permeation inside the film. © 2003 Elsevier B.V. All rights reserved.

Gallium-doped zinc oxide films were prepared by r.f. magnetron sputtering at room temperature as a function of the substrate-target distance. The best results were obtained for a distance of 10 cm, where a resistivity as low as 2. 7 × 10-4 Ω cm, a Hall mobility of 18 cm2/Vs and a carrier concentration of 1.3 × 1021 cm-3 were achieved. The films are polycrystalline presenting a strong crystallographic c-axis orientation (002) perpendicular to the substrate. The films present an overall transmittance in the visible part of the spectra of approximately 85%, on average. © 2003 Elsevier B.V. All rights reserved.

Thin film transistors (TFTs) have been produced by rf magnetron sputtering at room temperature, using non conventional oxide materials like amorphous indium-zinc-oxide (IZO) semiconductor, for the channel as well as for the drain and source regions. The obtained TFTs operate in the enhancement mode with threshold voltages of 2.4 V, saturation mobility of 22.7 cm2/Vs, gate voltage swing of 0.44 V/dec and an ON/OFF current ratio of 7×10 7. The high performances presented by these TFTs associated to a high electron mobility, at least two orders of magnitude higher than that of conventional amorphous silicon TFTs and a low threshold voltage, opens new doors for applications in flexible, wearable, disposable portable electronics as well as battery-powered applications.

The aim of this paper is to present a set of electric data concerning the performances before and after ageing of Cu-Sn-Cu joins used to solder power diodes and to compare the results achieved with the ones obtained in diodes soldered using the conventional technology. The set of results achieved show that the Cu-Sn-Cu joins present even better performances than the ones exhibited by diodes soldered using the conventional technology, without requiring the use of Mo discs to be inserted between the silicon crystal and the metal contacts (stud or finger) to compensate thermal mismatches.

In this paper we present results concerning the influence of laser energy and shot density on the electrical resistance, X-ray diffraction pattern, and structure obtained by SEM, on recrystallized a-Si:H thin films produced by using a Nd-YAG laser, working in a wavelength of 532 nm. The base material (undoped and doped a-Si:H) was obtained by Plasma Enhanced Chemical Vapour Deposition (PECVD). The structure and electrical characteristics of the recrystallized thin films are dependent on the laser beam energy density, beam spot size and the number of shots applied to the base a-Si:H thin film used. Overall, the data show recrystallized material with grain sizes larger than 1μm, where the electrical resistance of both, undoped and doped materials, can be varied up to 5 orders of magnitude, by the proper choice of the recrystallization conditions.