Role of the deposition parameters in the uniformity of films produced by the plasma-enhanced chemical vapour deposition technique
- Citation:
- Martins, R., Maçarico Ferreira Fidalgo Fortunato A. I. J. "Role of the deposition parameters in the uniformity of films produced by the plasma-enhanced chemical vapour deposition technique." Philosophical Magazine B: Physics of Condensed Matter; Statistical Mechanics, Electronic, Optical and Magnetic Properties. 76 (1997): 259-272.
Abstract:
The objective of this work is to present an analytical model able to interpret the experimental dependence of the uniformity of films produced by the plasma-enhanced chemical vapour deposition technique on the deposition parameters (discharge pressure, gas flow temperature and rf power density). The model proposed is based on the Navier-Stokes equations applied to a gas flow considered to be quasi-incompressible and quasi-inviscous, whenever the Mach number is below 0·3. This condition leads to the establishment of the proper quasisteady-state gas flow equations, and the corresponding equations of energy and momentum balance ascribed to the mass profile of the species formed, under the presence of a low-rf-power plasma density, are able to predict the uniformity distribution of the film over the entire deposited substrate area.
Notes:
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