@article {Martins1997259,
	title = {Role of the deposition parameters in the uniformity of films produced by the plasma-enhanced chemical vapour deposition technique},
	journal = {Philosophical Magazine B: Physics of Condensed Matter; Statistical Mechanics, Electronic, Optical and Magnetic Properties},
	volume = {76},
	number = {3},
	year = {1997},
	note = {<p>cited By 6</p>
},
	pages = {259-272},
	abstract = {<p>The objective of this work is to present an analytical model able to interpret the experimental dependence of the uniformity of films produced by the plasma-enhanced chemical vapour deposition technique on the deposition parameters (discharge pressure, gas flow temperature and rf power density). The model proposed is based on the Navier-Stokes equations applied to a gas flow considered to be quasi-incompressible and quasi-inviscous, whenever the Mach number is below 0{\textperiodcentered}3. This condition leads to the establishment of the proper quasisteady-state gas flow equations, and the corresponding equations of energy and momentum balance ascribed to the mass profile of the species formed, under the presence of a low-rf-power plasma density, are able to predict the uniformity distribution of the film over the entire deposited substrate area.</p>
},
	url = {https://www.scopus.com/inward/record.uri?eid=2-s2.0-0342478341\&partnerID=40\&md5=2ab85d8478085bcd75dc19791a2006d1},
	author = {Martins, R., Ma{\c c}arico, A., Ferreira, I., Fidalgo, J., Fortunato, E.}
}
