Rodrigo Martins

Citation:

Pereira, L., Barquinha Fortunato Martins P. E. R. "Influence of the oxygen/argon ratio on the properties of sputtered hafnium oxide." Materials Science and Engineering B: Solid-State Materials for Advanced Technology. 118 (2005): 210-213.

Abstract:

In this work we have focused our attention on the role of the gas mixture (O2/Ar) used during HfO2 thin film processing by r.f. magnetron sputtering, to produce dielectrics with suitable characteristics to be used as gate dielectric. Increasing the O2/Ar ratio from 0 to 0.2, the films properties (optical gap, permittivity, resistivity and compactness) are improved. At these conditions, films with a band gap around 5 eV were produced, indicating a good stoichiometry. Also the flat band voltage has a reduction of almost three times indicating also a reduction of the same order on the fixed charge density at the semiconductor-insulator interface. The dielectric constant is around 16 which is very good, since the surface of the silicon where the HfO2 films were deposited contains a SiO 2 layer of about 3 nm that gives an effective dielectric constant above 20, close to the HfO2 stoichiometric value (∼25). Further increase on the O2/Ar ratio does not produce significant improvements. © 2004 Elsevier B.V. All rights reserved.

Notes:

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