The role of the deposition pressure and hydrogen dilution in the production of p-type Si:H films by hot wire chemical vapor deposition, was investigated. The system used permits to obtain uniform and homogeneous films properties over a 10cm×10cm substrate area. As heated filament we used Ta, since Ta filaments have longer life period without deteriorating than the W filaments ones. In this work, we show that the electrical properties of the films produced are dependent on the process gas pressure. In the pressure range of 13.3 Pa (0.1 Torr) to 66.5 Pa (0.5Torr), the film's coplanar electrical conductivity at room temperature varies by more than two orders of magnitude, for films produced at same hydrogen dilution and filament temperature, reaching values of about 0.1 (Ωcm)-1, at deposition pressures of about 40-53Pa (0.3-0.4Torr). On the other hand, the increase in hydrogen dilution (from 87% to 96%) promotes the surface roughness due to an enlargement of grain sizes in the direction of the {220} diffraction planes as observed by SEM micrographs without changing the crystalline fraction (48-50%) obtained by micro-Raman analysis.

This work analyse mainly the dissociation mechanism of the gas during the hot wire (HW) and hot wire plasma-assisted (HWPA) processes used to produce hydrogenated carbon films and silicon-carbide, using ethylene and silane as gas sources. The results show that ethylene is better decomposed by plasma-enhanced chemical vapour deposition (PECVD) than HW process. The data also show that the HWPA leads to a better carbon © incorporation than HW processes, when silicon carbide alloys are produced and, that the presence of atomic hydrogen (H) is beneficial for all processes. That is, the presence of the plasma and H lead to the formation of higher C radicals such as methylsilane (CH3SiH3), ethylsilane (C2H5SiH3) and silorane (C2H4SiH2), whose contributions are enhanced as the fraction of ethylene (Feth) in the gas mixture increases. © 2001 Published by Elsevier Science B.V.

We report in this paper the influence of the rf power on the properties of p-type silicon thin films produced by hot wire plasma assisted chemical vapor deposition (HWPA-CVD) technique, using a gas mixture containing SiH4, B2H6, CH4 and H2. The influence of the rf power in the film morphology, its structure and its composition has been determined by means of scanning electron microscopy (SEM), X-ray diffraction (XRD) and infrared spectroscopy. The electrical dark conductivity, activation energy, optical band gap and growth rate values for the different rf power was also evaluated. The data achieved show that rf power rules the surface morphology, the film structure and its electrical characteristics. © 2001 Elsevier Science B.V. All rights reserved.