Rodrigo Martins

In this paper we present results concerning the optimisation of the electronic and mechanical properties presented by amorphous silicon (a-Si:H) thin films produced on polyimide (Kapton® VN) substrates with different thicknesses (25, 50 and 75 μm) by the plasma enhanced chemical vapour deposition (PECVD) technique. The purpose of this study is to obtain a low defect density as well as low residual stresses (specially at the interface) in order to provide good performances for large area (10 mm wide by 80 mm long) flexible position sensitive detectors. The electrical and optical properties presented by the films will be correlated to the sensor characteristics. The properties of samples have been measured by dark/photoconductivity, constant photocurrent measurements (CPM) and the results have been compared with films deposited on Corning 7059 glass substrates during the same run deposition. The residual stresses were measured using an active optical triangulation and angle resolved scattering. The preliminary results indicate that the thinner polymeric substrate with 25 μm presents the highest density of states, which is associated to the residual stresses and strains associated within the film. © 2002 Elsevier Science B.V. All rights reserved.

Doped and undoped a-Si:H and a-SiC:H films were deposited by R. F. decomposition of silane and silane/methane mixtures respectively, in a two consecutive (decomposition and deposition) chambers glow discharge capacitively coupled system. Their electro-optical properties were extensively investigated through dark conductivity, photoconductivity, spectral response, optical absorption, R. F. transmission spectra, electron spin ressonance and CxV MOS measurements.