O Portal do docente é uma ferramenta de apoio que permite a cada Professor da FCT NOVA criar autonomamente a sua página pessoal e aí inserir o seu curriculum, divulgar artigos científicos, apresentar as disciplinas leccionadas, partilhar feeds, etc.
Kholkin, AL, R. Martins, H. Aguas, I. Ferreira, V. Silva, OA Smirnova, M. E. V. Costa, P. M. Vilarinho, E. Fortunato, and JL Baptista. "Metal-ferroelectric thin film devices." Journal of non-crystalline solids. 299 (2002): 1311-1315. Abstract
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Leite, {João Alexandre}, and {José Júlio} Alferes. "MINERVA - A dynamic Logic Programming agent architecture." Intelligent Agents VIII: Agent Theories, Architectures, and Languages - 8th International Workshop, ATAL 2001, Revised Papers. Vol. 2333 LNAI. Lecture Notes in Computer Science (including subseries Lecture Notes in Artificial Intelligence and Lecture Notes in Bioinformatics), 2333 LNAI. Springer-Verlag, 2002. 141-157. Abstract
The periplasmic hydrogenase of Desulfovibrio vulgaris (Hildenbourough) is an all Fe-containing hydrogenase. It contains two ferredoxin type [4Fe-4S] clusters, termed the F clusters, and a catalytic H cluster. Recent X-ray crystallographic studies on two Fe hydrogenases revealed that the H cluster is composed of two sub-clusters, a [4Fe-4S] cluster ([4Fe-4S]H) and-a binuclear Fe cluster ([2Fe]H), bridged by a cysteine sulfur. The aerobically purified D. vulgaris hydrogenase is stable in air. It is inactive and requires reductive activation. Upon reduction, the enzyme becomes sensitive to O(2) indicating that the reductive activation process is irreversible. Previous EPR investigations showed that upon reoxidation (under argon) the H cluster exhibits a rhombic EPR signal that is not seen in the as-purified enzyme, suggesting a conformational change in association with the reductive activation. For the purpose of gaining more information on the electronic properties of this unique H cluster and to understand further the reductive activation process, variable-temperature and variable-field Mossbauer spectroscopy has been used to characterize the Fe-S clusters in D. vulgaris hydrogenase poised at different redox states generated during a reductive titration, and in the GO-reacted enzyme. The data were successfully decomposed into spectral components corresponding to the F and H clusters,and characteristic parameters describing the electronic and magnetic properties of the F and H clusters were obtained. Consistent with the X-ray crystallographic results, the spectra of the H cluster can be understood as originating from an exchange coupled [4Fe-4S] - [2Fe] system. In particular, detailed analysis of the data reveals that the reductive activation begins with reduction of the [4Fe-4S]H cluster from the 2+ to the If state, followed by transfer of the reducing equivalent from the [4Fe-4S]H subcluster to the binuclear [2Fe]H subcluster. The results also reveal that binding of exogenous CO to the H cluster affects significantly the exchange coupling between the [4Fe-4S]H and the [2Fe]H subclusters. Implication of such a CO binding effect is discussed.
A nonlinear DC servomotor model with friction, saturation, backlash and motor starting voltage is presented in this paper. Traditionally the position of a servo is controlled with a PD-controller. In the presence of disturbance, PID control results with overshoot and long recovery time. In simulations, the integral time of the controller is modified to fasten the recovery time. To control the position of the servomotor is proposed a Hybrid Control Architecture using a nonlinear PID controller and a Fuzzy PID controller. Simulation results with the Hybrid Controller are presented.
Results are presented concerning the morphological and structural characteristics exhibited by the Cu-Sn-Cu system to be used in electronic lead-free soldering processes, under different process temperatures and pressures. The results show that the Cu3Sn or Cu6Sn5 phases needed to supply the thermal, mechanical and electrical stability to the joints formed require Sn layers (either electrodeposited or by using preforms) whose thickness depends on the process temperature used. For process temperatures of 533 K the thickness of the Sn layer should be above 20 μm, while for process temperatures of 573 K, the Sn thickness required is reduced to 10 μm. The joints formed support shear stresses above 12 MPa, as required by electronic standards. Apart from that, microcracks start appearing if an excess of Sn is used during the soldering operation. The set of tests performed indicates that this new joint is quite promising to substitute the conventional solder process applied to power diodes.