Rodrigo Martins

Large-area thin-film position-sensitive detectors (TFPSDs) using the hydrogenated amorphous silicon (a-Si:H) technology are presented. The detection accuracy of these devices (lengths of about 80 mm) is better than ±0.5% of the value of the full scale of the sensor, the spatial resolution is better than ±20 μm, the non-linearities measured are below ±2% and the frequency response is in the range of a few kilohertz, compatible with the sampling frequency of most electromechanical assembling/control systems. The obtained results are quite promising regarding the application of these sensors to a wide variety of optical inspection systems. © 1998 Elsevier Science S.A. All rights reserved.

Large-area thin-film position-sensitive detectors (TFPSDs) using the hydrogenated amorphous silicon (a-Si:H) technology are presented. The detection accuracy of these devices (lengths of about 80 mm) is better than ±0.5% of the value of the full scale of the sensor, the spatial resolution is better than ±20 μm, the non-linearities measured are below ±2% and the frequency response is in the range of a few kilohertz, compatible with the sampling frequency of most electromechanical assembling/control systems. The obtained results are quite promising regarding the application of these sensors to a wide variety of optical inspection systems.

The aim of this paper is to present results on a new soldering process based on the low-temperature solidification of intermetallic phases from the system Cu-Sn-Cu which can be employed to form a heat-resistant die-attach as well as signal and power electric contacts. Because of the total transformation into intermetallic phase, the working temperature of the bond formed is several hundred degrees Celsius higher than the process temperature (around 250°C). This process leads to a homologous temperature T/Tm of about 0.3 compared to 0.7 in the case of soft SnAg solder alloy. Therefore a better reliability of the proposed bonding process is achievable. Results of the match of the predicted volume fraction of the intermetallic forms and the experimentally measured contact volume would be also discussed, for contacts formed in power diodes.

In this paper the influence of the DC grid bias on the plasma impedance and the I-V behaviour of silane plasmas used to grow undoped amorphous silicon films by plasma enhanced chemical vapour deposition technique using a triode configuration at or close to the powder regime is studied. The aim is to determine the correlation between the r.f. power and the DC grid voltage with the plasma parameters, under isothermal gas conditions. The results should lead to the production of nanostructured films, with the required optoelectronic characteristics for photovoltaic applications. The results achieved show the existence of a boundary region close to the γ-regime (powder formed) where nanoparticles can be formed by moderated ion bombardment of the growing surface. This is characterised by the plasma resistance of the same order of magnitude of the plasma reactance. Under this condition, it is possible to grow amorphous silicon films that can incorporate nanoparticles, exhibiting photosensitivities of about 107 (two orders of magnitude larger than the one exhibited by films grown under conventional conditions) with densities of states determined by the constant photocurrent method below 3 × 1015 cm3. Apart from that, the growth of the films is less affected by light soaking than the conventional films grown by standard techniques. © 2001 Elsevier Science Ltd. All rights reserved.

In this paper we report on large area one dimensional (1D) amorphous silicon position sensors deposited on flexible polymer foil substrate. The pin sensor structure was deposited by rf plasma enhanced chemical vapour deposition (PECVD). For the electrical and optical characterisation the sensors have been mounted on a convex holder with a 14-mm radius-of-curvature, since the main goal of this work is to develop a flexible position sensor to be incorporated in a micromotor in order to measure its angular velocity continuously. The obtained sensors present adequate performances concerning the position non-linearity (±1% in 20 mm length), comparable to those fabricated on glass substrates. © 2000 Elsevier Science B.V. All rights reserved.

UV-enhanced monocrystalline zinc sulphide optical sensors with high quantum efficiency have been developed by spray deposition of heavy fluorine-doped tin oxide (FTO) thin films onto the surface of zinc sulphide monocrystals as an alternative to the UV-enhanced high-efficiency silicon photodetectors commonly used in precise radiometric and spectroscopic measurements as well as to new sensors based on SiC and GaN. The fabricated sensors have an unbiased internal quantum efficiency that is nearly 100% from 250 to 320 nm, and the typical sensitivity at 250 nm is 0.15 A W-1. The sensors are insensitive to solar radiation in conditions on the earth and can be used as solar blind photodetectors for precision UV measurements under direct solar illumination for both terrestrial and space applications. © 1998 Elsevier Science S.A. All rights reserved.

UV-enhanced monocrystalline zinc sulphide optical sensors with high quantum efficiency have been developed by spray deposition of heavy fluorine-doped tin oxide (FTO) thin films onto the surface of zinc sulphide monocrystals as an alternative to the UV-enhanced high-efficiency silicon photodetectors commonly used in precise radiometric and spectroscopic measurements as well as to new sensors based on SiC and GaN. The fabricated sensors have an unbiased internal quantum efficiency that is nearly 100% from 250 to 320 nm, and the typical sensitivity at 250 nm is 0.15 A W-1. The sensors are insensitive to solar radiation in conditions on the earth and can be used as solar blind photodetectors for precision UV measurements under direct solar illumination for both terrestrial and space applications.

This work focuses on the role of the native oxide layer (SiO2) on the nickel (Ni)-assisted crystallization of amorphous silicon (a-Si). In some samples, the native oxide was removed using a HF-diluted solution before Ni layers with 0.5 nm be deposited on a-Si. The results show that the presence of a thin SiO2 layer of about 3 nm between the a-Si and the Ni delays the crystallization process. Ellipsometry data show that, after annealing for 5 h at 500 °C, the HF-cleaned sample presents a crystalline fraction of 88%, while the one with the native oxide has only 35%. This difference disappears after 20 h where both samples present similar crystalline fraction. These facts are also reflected on the film's electrical properties, where the activation energy for samples annealed for 5 h rises from 0.42 eV to 0.55 eV, when the oxide layer is removed. After 20 h and 30 h, the activation energy is around 0.55 eV for both kinds of samples, meaning that films with similar electrical properties are now obtained. However, the XRD data suggest the presence of some structural differences attributed to slight differences on the crystallization process. © 2005 Elsevier B.V. All rights reserved.

Total hip replacement is a common practice in every day clinical work. Artificial hip implants consist of a femoral component and an acetabular component. Nowadays the acetabular component is composed of a polymeric cup and a metallic shell. This study focuses the development of an innovative acetabular component substituting the metallic shell by a multilayer coating on the acetabular cup. A titanium coating was deposited onto ultra-high molecular weight polyethylene (UHMWPE) samples by physical vapour deposition (PVD), having an in situ pre-treatment with argon ion bombardment in order to optimize the adhesive strength by surface modification, followed by the deposition of a thin film of hydroxyapatite (HA) using rf magnetron sputtering technique, at room temperature. Results obtained seem to indicate that these multilayer coatings can be a viable alternative to the metallic shell, leading to the substitution of a two part for a one part acetabular component.

This work presents preliminary results in the study of a novel structure for a laser scanned photodiode (LSP) type of image sensor. In order to increase the signal output, a stacked p-i-n-p-i-n structure with an intermediate light-blocking layer is used. The image and the scanning beam are incident through opposite sides of the sensor and their absorption is kept in separate junctions by an intermediate light-blocking layer. As in the usual LSP structure the scanning beam-induced photocurrent is dependent on the local illumination conditions of the image. The main difference between the two structures arises from the fact that in this new structure the image and the scanner have different optical paths leading to an increase in the photocurrent when the scanning beam is incident on a region illuminated on the image side of the sensor, while a decreasing in the photocurrent was observed in the single junction LSP. The results show that the structure can be successfully used as an image sensor even though some optimization is needed to enhance the performance of the device. © 2004 Elsevier B.V. All rights reserved.