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We have developed a rectangular dual-axis large area Position Sensitive Detector (PSD), with 5 cm×5 cm detection area, based on PIN hydrogenated amorphous silicon (a-Si:H) technology, produced by Plasma Enhanced Chemical Vapor Deposition (PECVD). The metal contacts are located in the four edges of the detected area, two of them located on the back side of the ITO/PIN/Al structure and the others two located in the front side. The key factors of the detectors resolution and linearity are the thickness uniformity of the different layers, the geometry and the contacts location. Besides that, edge effects on the sensor's corner disturb the linearity of the detector. In this paper we present results concerning the linearity of the detector as well as its optoelectronic characteristics and the role of the i-layer thickness on the final sensor performances.

We have developed large area (up to 80mm×80mm) Thin Film Position Sensitive Detectors (TFPSD) based on hydrogenated amorphous silicon (a-Si:H). Although crystalline silicon PSDs have been realized and applied to optical systems, their detection area is small (less than 10mm×10mm), which implies the need of optical magnification systems for supporting their field of applications towards large area inspection systems, which does not happen by using a-Si:H devices. The key factors for the TFPSDs resolution are the thickness uniformity of the constituting layers, the geometry and the position of the contacts. In this paper we present data on single and dual-axis rectangular TFPSDs correlating, their performances with the different underlying lateral effects. For the single axis-detector, with two opposite extended contacts, the output photocurrent difference to sum ratio is a linear function of the position of a narrow incident light beam, even for low illumination levels (below 20 lux). For the dual-axis detector with extended contacts, at all four sides (except for small gaps at the vertices due to edge effects) an almost linear relation has been found between the incident light spot position along both axis and the corresponding output photocurrents. © 1993.

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PIN solar cells were light soaked up to 60 hours. The cell characteristics, the optoelectronic properties and the microstructure parameter (R = I2100/I2100+I2000) as well as the hydrogen content (CH) and density of states (g(Ef)) of the active i-layer were monitored throughout the entire light induced degradation process and compared with the correspondents μτ product (for both carriers) inferred through steady photoconductivity and FST measurements. Data show a strong correlation between the decrease of μτ product for electron and the increase of the fraction of hydrogen bonded on internal surfaces (R increases from 0.1 to 0.4) suggesting structural changes during the light induced defects' formation. For holes, the μτ product remains approximately constant and only dependent on the initial hydrogen content. As g(Ef) increases, μτ presents an asymmetrical decrease showing that electrons are more sensitive to defects' growth than holes. We also observe that the rate of degradation is faster for samples having the lowest defect densities, R and CH, showing that the amount of degradation is not a simple function of the photon exposure (Gt product) but also depends on the material microstructure.

This paper deals with a new model and structure able to tailor defects in pin devices. The model assumes the usual density of states profile, including donor and acceptor like states inside the mobility gap and has the capability to simulate the transient and steady state device behavior. The new structure is based in two interfacial defectous layers, located at the junctions, acting as "gettering" centers to tailor the defects. The role of the interlayer and its thickness on device performances will be also discussed. © 1993.

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A study using a primary Cs’ beam to carry out positive SIMS on conductive samples is presented. The energy distribution of positive secondary ions was measured and the sputter yield, S’ was calculated for several elements, The significantly different energetic behavior found between the secondary cesium ions and those ejected from the target will be discussed. Finally, the best conditions to perform positive SIMS with such a primary beam will be described.

Mode of operation and area of rnhanced efficiency for series-resonant converters is presented. Frequency control on voltage source DC-DC converters is discussed and other principles of control are introduced. Optimum modes of operation for power transistor resonant converters are also considered. For even better efficiency a resonant current shaping is discussed.

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