Rodrigo Martins

P- and n-type silicon thin films have been produced using a new hot wire plasma assisted deposition process that combines the conventional plasma enhanced chemical vapor deposition and the hot wire techniques. The films were produced in the presence of different hydrogen gas flow and their optoelectronic, structural and compositional properties have been studied. The optimized optoelectronic results achieved for n-type Si:H films are conductivity at room temperature of 9.4(Ωcm)-1 and optical band gap of 2eV while for p-type SiC:H films these values are 1 × 10-2(Ωcm)-1 and 1.6eV, respectively. The films exhibit the required optoelectronic characteristics and compactness for device applications such as solar cells.

Electrospun fibers of poly[(9,9-dioctylfluorenyl-2,7-diyl)-co-bithiophene] (F8T2) with exceptional electro-optical performance are obtained. The I/T characteristics measured in fibers with 7-15 μm diameter and 1 mm length show a semiconductor behavior; their thermal activation energy is 0.5 eV and the dark conductivity at RT is 5 × 10-9 (Ω cm)-1. Besides exhibiting a photosensitivity of about 60 under white light illumination with a light power intensity of 25 mW · cm-2, the fibers also attain RT photoluminescence in the cyan, yellow, and red wavelength range under ultraviolet, blue, and green light excitation, respectively. Optical microscope images of F8T2 reveal homogeneous electrospun fibers, which are in good agreement with the uniformly radial fluorescence observed. The production of electrospun fibers from poly[(9,9-dioctylfluorenyl-2,7-diyl)-co-bithiophene] (F8T2) obtained without a carrier polymer is reported. The obtained fibers are shown to have properties suitable for organic fiber photovoltaic and sensors applications. Copyright © 2013 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.

In this paper we report results of nanocrystalline p-doped silicon films produced by hot wire chemical vapour deposition technique with Ta filaments, using a pre-mixed gas containing silane, diborane, methane, helium and hydrogen. The data obtained show that the films produced exhibit good optoelectronic properties and show a surface morphology dependent on the filament temperature and hydrogen dilution. The increase in the filament temperature, keeping constant the hydrogen dilution (87%), promotes the preferential growth of the crystals in the {220} direction, giving rise to a pyramidal-like surface structure. This behaviour is observed by the SEM micrographs as well as by the micro-Raman and X-ray diffraction analyses. On the other hand, using a constant filament temperature, the increase in the hydrogen dilution contributes to an increase in both {111} and {220} diffraction peaks. Thus, by combining both filament temperature and hydrogen dilution the film surface can be controlled from a smooth to a pyramidal-like structure, without decreasing the crystalline fraction of the films. The structure and morphology is also reflected in the stability of the electrical dark conductivity. We observe that this property depends on the temperature range of the measurements and on the exposition time of films to the atmospheric conditions. © 2002 Elsevier Science Ltd. All rights reserved.

Results are presented concerning the morphological and structural characteristics exhibited by the Cu-Sn-Cu system to be used in electronic lead-free soldering processes, under different process temperatures and pressures. The results show that the Cu3Sn or Cu6Sn5 phases needed to supply the thermal, mechanical and electrical stability to the joints formed require Sn layers (either electrodeposited or by using preforms) whose thickness depends on the process temperature used. For process temperatures of 533 K the thickness of the Sn layer should be above 20 μm, while for process temperatures of 573 K, the Sn thickness required is reduced to 10 μm. The joints formed support shear stresses above 12 MPa, as required by electronic standards. Apart from that, microcracks start appearing if an excess of Sn is used during the soldering operation. The set of tests performed indicates that this new joint is quite promising to substitute the conventional solder process applied to power diodes.

We report in this paper the influence of the rf power on the properties of p-type silicon thin films produced by hot wire plasma assisted chemical vapor deposition (HWPA-CVD) technique, using a gas mixture containing SiH4, B2H6, CH4 and H2. The influence of the rf power in the film morphology, its structure and its composition has been determined by means of scanning electron microscopy (SEM), X-ray diffraction (XRD) and infrared spectroscopy. The electrical dark conductivity, activation energy, optical band gap and growth rate values for the different rf power was also evaluated. The data achieved show that rf power rules the surface morphology, the film structure and its electrical characteristics. © 2001 Elsevier Science B.V. All rights reserved.

This work analyse mainly the dissociation mechanism of the gas during the hot wire (HW) and hot wire plasma-assisted (HWPA) processes used to produce hydrogenated carbon films and silicon-carbide, using ethylene and silane as gas sources. The results show that ethylene is better decomposed by plasma-enhanced chemical vapour deposition (PECVD) than HW process. The data also show that the HWPA leads to a better carbon © incorporation than HW processes, when silicon carbide alloys are produced and, that the presence of atomic hydrogen (H) is beneficial for all processes. That is, the presence of the plasma and H lead to the formation of higher C radicals such as methylsilane (CH3SiH3), ethylsilane (C2H5SiH3) and silorane (C2H4SiH2), whose contributions are enhanced as the fraction of ethylene (Feth) in the gas mixture increases. © 2001 Published by Elsevier Science B.V.

This work reports the use of undoped porous amorphous/nanocrystalline hydrogenated silicon (a/nc-Si:H) thin films produced by hot wire chemical vapour deposition (HW-CVD) as ethanol detector above 50ppm and as a primary fuel cell where a power of 4μW/cm2 was obtained in structures of the type glass/ITO/i-a-nc-Si:H/Al. The porous silicon looks like a sponge constituted by grains and cluster of grains that determines the type of surface morphology and the behaviour of the structure under the presence of vapour moisture. Apart from that, the detector/device performances will also depend on the type of interlayer and interfaces with the metal contacts. The sponge like structure adsorbs the OH groups in uncompensated bonds, which behave as donor-like carriers, leading to an increase in the current flowing through the material, directly dependent on the ethanol vapour pressure. The corresponding role of the components of the microstructure on this detector was investigated by spectroscopic impedance. The response time of the current of the sensor and its recovery time are in the range of 10-50s at room temperature. © 2004 Elsevier B.V. All rights reserved.

In this paper, we investigate the optoelectronic properties and the photodegradation of amorphous silicon films produced by the hot wire plasma assisted technique (HWPA-CVD). We observed that hydrogen dilution in the gas phase plays an important role in the time dependence of the photoconductivity, which is correlated with an enhancement of defect density. We also compare the degradation of these films with those produced by plasma enhanced and by hot wire chemical vapour deposition techniques (PECVD and HW-CVD) and we found lower time dependence for the photodegradation of the films produced by HWPA-CVD technique © 2003 Elsevier B.V. All rights reserved.

Thin-films of copper oxide Cu O were produced by thermal oxidation of metallic copper (Cu) at different temperatures (150-450 C). The films produced at temperatures of 200, 250 and 300 C showed high Hall motilities of 2.2, 1.9 and 1.6 cm V s , respectively. Single Cu O phases were obtained at 200 C and its conversion to CuO starts at 250 C. For lower thicknesses 40 nm, the films oxidized at 250 C showed a complete conversion to CuO phase. Successful thin-film transistors (TFTs) were produce by thermal oxidation of a 20 nm Cu film, obtaining p-type Cu O (at 200 C) and CuO (at 250 C) with On/Off ratios of 6 10 and 1 10 , respectively. © 2005-2012 IEEE.

Copper oxide thin films were obtained by annealing (temperature ranging between 100 and 450 °C) the metallic Cu films deposited on glass substrates by e-beam evaporation. XRD studies confirmed that the cubic Cu phase of the asdeposited films changes into single cubic Cu 2Ophase and single monoclinic CuO phase, depending on the annealing conditions. The crystallite size is varied betweeñ12 and 31 nm. The lattice parameters of cubic Cu and Cu 2Ophases are estimated tõ3.60 and ̃4.26 Å , respectively. The films with Cu 2O phase showed p-type characteristics. The conductivity is decreased linearly with the decreasing temperature (1/T), which has confirmed the semiconductor nature of the deposited films. The calculated activation energy is varied between 0.10 and 0.16 eV. The surface microstructure is changed depending on the variation in the annealing temperature. The poor transmittance of the asdeposited films (<1%) is increased to a maximum of ̃80% (800 nm) on annealing at 200 °C. The estimated direct allowed band gap is varied between 1.73 and 2.89 eV. © 2009 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.

Thin-films of copper oxide Cu x were sputtered from a metallic copper (Cu) target and studied as a function of oxygen partial pressure. A metallic Cu film with cubic structure obtained from 0% O PP has been transformed to cubic Cu x phase for the increase in O PP to 9% but then changed to monoclinic CuO phase (for. The variation in crystallite size (calculated from x-ray diffraction data) was further substantiated by the variation in grain size (surface microstructures). The Cu x films produced with O PP ranging between 9% and 75% showed p-type behavior, which were successfully applied to produce thin-film transistors. © 2006 IEEE.

Thin films of copper oxide were obtained through thermal oxidation (100-450 °C) of evaporated metallic copper (Cu) films on glass substrates. The X-ray diffraction (XRD) studies confirmed the cubic Cu phase of the as-deposited films. The films annealed at 100 °C showed mixed Cu-Cu2O phase, whereas those annealed between 200 and 300 °C showed a single cubic Cu2O phase. A single monoclinic CuO phase was obtained from the films annealed between 350 and 450 °C. The positive sign of the Hall coefficient confirmed the p-type conductivity in the films with Cu2O phase. However, a relatively poor crystallinity of these films limited the p-type characteristics. The films with Cu and CuO phases show n-type conductivity. The surface of the as-deposited is smooth (RMS roughness of 1.47 nm) and comprised of uniformly distributed grains (AFM and SEM analysis). The post-annealing is found to be effective on the distribution of grains and their sizes. The poor transmittance of the as-deposited films (<1%) is increased to a maximum of ∼80% (800 nm) on annealing at 200 °C. The direct allowed band gap is varied between 2.03 and 3.02 eV. © 2008 Elsevier B.V. All rights reserved.

We have characterized the structure and electrical properties of p-type nanocrystalline silicon films prepared by radio-frequency plasma-enhanced chemical vapor deposition and explored optimization methods of such layers for potential applications in thin-film solar cells. Particular attention was paid to the characterization of very thin (∼20nm) films. The cross-sectional morphology of the layers was studied by fitting the ellipsometry spectra using a multilayer model. The results suggest that the crystallization process in a high-pressure growth regime is mostly realized through a subsurface mechanism in the absence of the incubation layer at the substrate-film interface. Hydrogen plasma treatment of a 22-nm-thick film improved its electrical properties (conductivity increased more than ten times) owing to hydrogen insertion and Si structure rearrangements throughout the entire thickness of the film. © 2012 National Institute for Materials Science.

In this paper we present a study of boron-doped nc-Si:H films prepared by PECVD at high deposition pressure (≥4 mbar), high plasma power and low substrate temperature (≤200 °C) using trimethylboron (TMB) as a dopant gas. The influence of deposition parameters on electrical, structural and optical properties is investigated. We determine the deposition conditions that lead to the formation of p-type nanocrystalline silicon thin films with very high crystallinity, high value of dark conductivity (>7 (Ω cm)-1) and high optical band gap (≥1.7 eV). Modeling of ellipsometry spectra reveals that the film growth mechanism should proceed through a sub-surface layer mechanism that leads to silicon crystallization. The obtained films are very good candidates for application in amorphous and nanocrystalline silicon solar cells as a p-type window layer. © 2009 Elsevier Ltd. All rights reserved.

Gallium-doped zinc oxide films were prepared by rf magnetron sputtering at room temperature as a function of the substrate-target distance. The best results were obtained for a distance of 10 cm, where a resistivity as low as 2.7×10-4 Ωcm, a Hall mobility of 18 cm2/Vs and a carrier concentration of 1.3×1021 cm-3 were achieved. The films are polycrystalline presenting a strong crystallographic c-axis orientation (002) perpendicular to the substrate. The films present an overall transmittance in the visible part of the spectra of about 85 %, in average. The low resistivity, accomplished with a high growth rate deposited at RT, enables the deposition of these films onto polymeric substrates for flexible applications.

In this paper we report on large area one dimensional (1D) amorphous silicon position sensors deposited on flexible polymer foil substrate. The pin sensor structure was deposited by rf plasma enhanced chemical vapour deposition (PECVD). For the electrical and optical characterisation the sensors have been mounted on a convex holder with a 14-mm radius-of-curvature, since the main goal of this work is to develop a flexible position sensor to be incorporated in a micromotor in order to measure its angular velocity continuously. The obtained sensors present adequate performances concerning the position non-linearity (±1% in 20 mm length), comparable to those fabricated on glass substrates. © 2000 Elsevier Science B.V. All rights reserved.

In this paper we present the effect of the insertion of a non-doped nanocrystalline zinc oxide/buffer layer on the electrical, optical and structural properties of indium tin oxide produced at room temperature by radio frequency plasma enhanced reactive thermal evaporation on polymeric substrates. The electrical resistivity of the ITO films is reduced by more than two orders of magnitude (4.5×10-1 to 2.9×10-3 Ωcm). From the Hall effect measurements it is observed that the large decrease associated to the electrical resistivity, is due to the increase associated to the Hall mobility. Concerning the optical properties no effect was observed, being the transmittance in the visible and near the infra red region always higher than 80%.

High mobility bottom gate thin film transistors (TFTs) with an amorphous gallium tin zinc oxide (a-GSZO) channel layer have been produced by rf magnetron cosputtering using a gallium zinc oxide (GZO) and tin (Sn) targets. The effect of postannealing temperatures (200, 250, and 300 °C) was evaluated and compared with two series of TFTs produced at room temperature (S1) and 150 °C (S2) during the channel deposition. From the results, it was observed that the effect of postannealing is crucial for both series of TFTs either for stability as well as for improving the electrical characteristics. The a-GSZO TFTs (WL=5050 μm) operate in the enhancement mode (n -type), present a high saturation mobility of 24.6 cm2 V s, a subthreshold gate swing voltage of 0.38 V /decade, a turn-on voltage of -0.5 V, a threshold voltage of 4.6 V, and an Ion Ioff ratio of 8× 107, satisfying all the requirements to be used as active-matrix backplane. © 2008 American Institute of Physics.

The aim of this work is to present an analytical model able to interpret the role of the thin collecting resistive layer on the static performances exhibited by 2D amorphous silicon hydrogenated pin thin film position sensitive detectors. In addition, experimental results concerning the device linearity and spatial resolution are presented and checked against the predicted values of the analytical model proposed.

We have developed a linear thin film position-sensitive detector with 128 elements, based on p.i.n. a-Si:H devices. The incorporation of this sensor into an optical inspection camera makes possible the acquisition of three-dimensional information of an object, using laser triangulation methods. The main advantages of this system, when compared with the conventional charge-coupled devices, are the low complexity of hardware and software used, and that the information can be continuously processed (analogic detection). In this paper, we present the most significant characteristics of the singular one-dimensional thin film position-sensitive detectors that form part of the linear array with 128 sensors. © 1998 Elsevier Science S.A.

In this paper we present results of indium doped zinc oxide deposited at room temperature by rf magnetron sputtering, with electron mobility as high as 60 cm2/Vs. The films present a resistivity as low as 5×10 -4 Ωcm with an optical transmittance of 85%. The structure of these films look-like polymorphous (mixed of different amorphous and nanocrystalline phases from different origins) as detected from XRD patterns (no clear peak exists) with a high smooth surface, as detected from SEM micrographs, highly important to ensure long life time when used in display devices.

The aim of this work is to determine the role of different metal contacts on the performances of one-dimensional thin-film position-sensitive detectors produced by plasma-enhanced chemical vapour deposition, to be used in optical rulers for alignment applications. The device consists on an indium tin oxide/p-i-n structure where the metal contacts used were based on Al, Al + Cu and Ag. The results achieved show that the contact mainly influences the final sensor range by limiting the magnitude of the analogue signals recorded. In spite of soldering problems the Al contact was the contact that lead to better discrimination of the sensor, with a nonlinearity of ±0.8% and a fall-off parameter of 3.2 × 10-3 cm-1. The Al + Cu contact also exhibits good performances (nonlinearity, of ±1.1%; fall-off parameter, 1.4 × 10-2 cm-1) and should be chosen since it is much easier to solder but requires protection against oxidation. The integration of these sensors on the optical ruler lead to the production of a system with a response time below 0.5 ms, an accuracy better than ±1% and a mechanical precision of better than 0.25 mm in 100 mm, with a full-scale noise below ±0.1%.

In this paper we report by the first time tunneling tranport on vertical μcSi/aSixCyOz:H/μcSi (μcaμc) heterostructures produced in a Two consecutive Decomposition and Deposition Chamber system where a Negative Differential Conductance is observed even at room temperature. Giant bias anomalies are observed, that decrease with temperature. Tunneling spectroscopy data are also reported for samples measured at low temperatures. A qualitative information of the recorded data is obtained and related with main features of the heterostructure. Nevertheless in this stage is hard to take quantitative information. © 1989.

Pd-metal/insulator/semiconductor based on hydrogenated amorphous silicon were produced by plasma enhanced chemical vapour deposition with two different oxidised surfaces: thermal in ambient air and chemical with hydrogen peroxide. The diode characteristics have been investigated using dark and light current as f(v) measurements in the temperature range from 300 K to 380 K, from which it was possible to infer the electron barrier height. The data obtained show that the incorporation of a thin insulator layer between the semiconductor and the metal improves the performances of the devices by preventing the formation of suicides at the interface. Apart from that we also show that the MIS structures with the thermal oxide presents 'better' performances than the ones with the chemical oxide due to the type of interface states and of the oxide charges associated with the interface between the insulator and the semiconductor. © 1998 Elsevier Science B.V. All rights reserved.