Publications

Export 575 results:
Sort by: [ Author  (Desc)] Title Type Year
A B C D E F G H I J K L M N O P Q R S T U V W X Y Z 
P
Prabakaran, R.a, Peres Monteiro Fortunato Martins Ferreira M. b T. b. "The effects of ZnO coating on the photoluminescence properties of porous silicon for the advanced optoelectronic devices." Journal of Non-Crystalline Solids. 354 (2008): 2181-2185. AbstractWebsite

In the present work we investigate, the role of zinc oxide (ZnO) thin films passivating layer deposited by rf magnetron sputtering at room temperature on low (18%) and high (80%) porosity porous silicon (PS). The micro-Raman spectroscopy, Fourier transform infrared spectroscopy (FTIR) and atomic force microscopy (AFM) analysis have been carried out to understand the effect of ZnO films coating on PS. A systematic investigation from Raman spectroscopy suggests the formation of a good quality ZnO wurtzite structure on PS. The photoluminescence (PL) measurements on PS and ZnO coated PS shows a red, blue and UV emission bands at around ∼1.8, ∼2.78 and ∼3.2 eV. An enhancement of all PL emission bands have been achieved after ZnO films deposition on high porosity PS. © 2007 Elsevier B.V. All rights reserved.

Prabakaran, R., Aguas Pereira Elangovan Fortunato Martins Ferreira H. L. E. "Optical and microstructural investigations of porous silicon coated with a-Si:H using PECVD technique." Materials Science Forum. 587-588 (2008): 308-312. AbstractWebsite

In the present work, the spectroscopic ellipsometry (1.5 - 5.5 eV) was used to investigate the effects of current density induced microstructural variations and their influence on the electronic states of as-prepared and a-Si:H coated porous silicon (PS). The pseudodielectric responses of the low and high current densities (5 and 40 mA/cm2) were analyzed using a multilayer model within the effective medium approximation. The FTIR investigation reveals me enhancement of surface oxide (Si-Ox) layer with current density and the improvement of the Si-Hx band after a-Si:H coating.

Prabakaran, R., Aguas Fortunato Martins Ferreira H. E. R. "n-PS/a-Si:H heterojunction for device application." Journal of Non-Crystalline Solids. 354 (2008): 2632-2636. AbstractWebsite

In this work, we investigate the role of amorphous silicon (a-Si:H) thin films deposited by a plasma enhanced chemical vapor deposition (PECVD) technique on porous silicon (PS) to facilitate its water vapor and oxygen gas sensing properties using its electrical response. Overall we notice a rectifying behavior from a-Si:H/PS heterojunction device, where a current enhancement of one and four orders of magnitude was observed in the presence of oxygen gas and water vapor, in comparison with atmospheric air at room temperature, respectively. The photoluminescence (PL) investigation of PS shows a slight blue shift in the PL emission band from 1.72 to 1.77 eV and the intensity of the PL is enhanced by a factor of 5.4 with increase of porosity from 21% to 77%. This PL emission may originate from the O-Si-H related absorbance bands. Alternatively, quenching of the PL intensity was observed after a-Si:H films were deposited on PS specimens. Besides, micro-Raman and atomic force microscopic (AFM) analyse were carried out to understand the structure and morphological features of the PS and a-Si:H/PS specimens. © 2007 Elsevier B.V. All rights reserved.

Pinto, J.V.a, Branquinho Barquinha Alves Martins Fortunato R. a P. a. "Extended-gate ISFETs based on sputtered amorphous oxides." IEEE/OSA Journal of Display Technology. 9 (2013): 729-734. AbstractWebsite

We present the results obtained with an extended-gate ISFET totally based on amorphous oxides (GIZO as the semiconductor, +{\hbox{Ta}}-{2}{\hbox{O}}-{5}{\ hbox{:SiO}}-inf2-inf as the dielectric and +{\hbox{Ta}}-{2}{\hbox{O}}-inf5-inf as the sensitive layer). A full characterization of the device was performed with constant ionic strength pH buffer solutions, revealing a sensitivity of 40 mV/pH with small hysteresis, and good linearity in the pH 4-pH 10 range buffer solutions. These results clearly show that it is possible to produce room-temperature disposable and low cost bio-sensors. © 2005-2012 IEEE.

Pimentel, A., Ferreira Nunes Calmeiro Martins Fortunato S. H. D. "Microwave synthesized ZnO nanorod arrays for UV sensors: A seed layer annealing temperature study." Materials. 9 (2016). AbstractWebsite

The present work reports the influence of zinc oxide (ZnO) seed layer annealing temperature on structural, optical and electrical properties of ZnO nanorod arrays, synthesized by hydrothermal method assisted by microwave radiation, to be used as UV sensors. The ZnO seed layer was produced using the spin-coating method and several annealing temperatures, ranging from 100 to 500 °C, have been tested. X-ray diffraction (XRD), scanning electron microscopy (SEM), atomic force microscopy (AFM) and spectrophotometry measurements have been used to investigate the structure, morphology, and optical properties variations of the produced ZnO nanorod arrays regarding the seed layer annealing temperatures employed. After the growth of ZnO nanorod arrays, the whole structure was tested as UV sensors, showing an increase in the sensitivity with the increase of seed layer annealing temperature. The UV sensor response of ZnO nanorod arrays produced with the seed layer annealed temperature of 500 °C was 50 times superior to the ones produced with a seed layer annealed at 100 °C. © 2016 by the authors.

Pimentel, A.a, Rodrigues Duarte Nunes Costa Monteiro Martins Fortunato J. b P. a. "Effect of solvents on ZnO nanostructures synthesized by solvothermal method assisted by microwave radiation: a photocatalytic study." Journal of Materials Science. 50 (2015). AbstractWebsite

Abstract: The present work reports the synthesis of zinc oxide (ZnO) nanoparticles with hexagonal wurtzite structure considering a solvothermal method assisted by microwave radiation and using different solvents: water (H2O), 2-ethoxyethanol (ET) and ethylene glycol (EG). The structural characterization of the produced ZnO nanoparticles has been accessed by scanning electron microscopy, X-ray diffraction, room-temperature photoluminescence and Raman spectroscopies. Different morphologies have been obtained with the solvents tested. Both H2O and ET resulted in rods with high aspect ratio, while EG leads to flower-like structure. The UV absorption spectra showed peaks with an orange shift for synthesis with H2O and ET and blue shift for synthesis with EG. The different synthesized nanostructures were tested for photocatalyst applications, revealing that the ZnO nanoparticles produced with ET degrade faster the molecule used as model dye pollutant, i.e. methylene blue. Graphical Abstract: [Figure not available: see fulltext.] © 2015 Springer Science+Business Media New York

Pimentel, A.C., Gonçalves Marques Martins Fortunato A. A. R. "Zinc oxide thin films used as an ozone sensor at room temperature." Materials Research Society Symposium Proceedings. Vol. 915. 2006. 243-248. Abstract

In this paper we present results of intrinsic/non doped zinc oxide films deposited at room temperature by rf magnetron sputtering able to be used as a truly semiconductor on electronic devices like ozone gas sensors and ultra-violet detectors. The produced films are polycrystalline with a c-axis preferential orientation parallel to the substrate. The films' resistivity varies from 4.0×10-2 Ωcm to 1.0×10-9 Ωcm, depending on the deposition conditions used (rf power density and oxygen partial pressure), which turns not affecting the optical properties (in average a transmittance of around 85 % and an optical band gap of about 3.44 eV, independent of the deposition conditions used). When exposed to UV light the sensor response based on these films may exceed more than 5 orders of magnitude, recovering to the initial state in the presence of ozone. The sensitivity of the films is improved when the oxygen partial pressure increases and the rf power density used decreases, due to changes on the structural properties of the films. © 2006 Materials Research Society.

Pimentel, A.C., Gonçalves Marques Martins Fortunato A. A. R. "Role of the thickness on the electrical and optical performances of undoped polycrystalline zinc oxide films used as UV detectors." Journal of Non-Crystalline Solids. 352 (2006): 1448-1452. AbstractWebsite

In this paper we present the effect of thickness on the electrical and optical properties of intrinsic/nondoped zinc oxide thin films deposited at room temperature by radio frequency magnetron sputtering, able to be used as a semiconductor material on electronic devices, like for example ozone gas sensors and ultraviolet detectors. These films are polycrystalline with a c-axis preferential orientation parallel to the substrate. The films present a resistivity that varies from 5.0 × 104 Ω cm to 1.0 × 109 Ω cm with an optical visible transmittance of 85%. The sensor response exceeds more than five orders of magnitude when exposed to UV light recovering to the initial state in the presence of ozone. © 2006 Elsevier B.V. All rights reserved.

Pimentel, A., Fortunato Gonçalves Marques Águas Pereira Ferreira Martins E. A. A. "Polycrystalline intrinsic zinc oxide to be used in transparent electronic devices." Thin Solid Films. 487 (2005): 212-215. AbstractWebsite

In this paper we present results of intrinsic/non-doped zinc oxide deposited at room temperature by radio frequency magnetron sputtering able to be used as a semiconductor material on electronic devices, like for example ozone gas sensors, ultra-violet detectors and thin film transistors. These films present a resistivity as high as 2.5×108 Ω cm with an optical transmittance of 90%. Concerning the structural properties, these films are polycrystalline presenting a uniform and very smooth surface. © 2005 Elsevier B.V. All rights reserved.

Pereyra, I., Andrade Sanematsu Martins A. M. M. S. "ELECTRO-OPTICAL CHARACTERIZATION OF AMORPHOUS SILICON FILMS DEPOSITED IN A TWO CONSECUTIVE DECOMPOSITION AND DEPOSITION CHAMBERS SYSTEM." Commission of the European Communities, (Report) EUR. 1985. 717-721. Abstract

Doped and undoped a-Si:H and a-SiC:H films were deposited by R. F. decomposition of silane and silane/methane mixtures respectively, in a two consecutive (decomposition and deposition) chambers glow discharge capacitively coupled system. Their electro-optical properties were extensively investigated through dark conductivity, photoconductivity, spectral response, optical absorption, R. F. transmission spectra, electron spin ressonance and CxV MOS measurements.

Pereira, L., Águas Raniero Martins Fortunate Martins H. L. R. "Role of substrate on the growth process of polycrystalline silicon thin films by low-pressure chemical vapour deposition." Materials Science Forum. 455-456 (2004): 112-115. AbstractWebsite

This paper deals with the role the substrate on the structure of undoped and n-doped polycrystalline silicon (poly-Si) films produced by Low Pressure Chemical Vapour Deposition (LPCVD). The structural and electrical properties of the films deposited on glass, glass covered with molybdenum (Mo), oxidised crystalline silicon and oxidised crystalline silicon covered with Mo were analysed using X-ray diffraction and Spectroscopic Ellipsometry, dark conductivity and Hall effect measurements. Undoped poly-Si films deposited over Mo present modifications in the crystalline structure relatively to those deposited on the other substrates. The presence of Mo changes the preferential growth orientation, enhancing the Si {111} grains orientation, leading to more compact films. The electrical measurements also confirm that the films grown on Mo substrates present better characteristics. Some differences are also observed during the initial growth stages when using glass or oxidised silicon. Very thin n-doped films present a less effective doping effect when deposited on oxidised silicon than the ones deposited on glass substrates.

Pereira, L., Águas Martins Fortunato Martins H. R. M. "Polycrystalline silicon obtained by gold metal induced crystallization." Journal of Non-Crystalline Solids. 338-340 (2004): 178-182. AbstractWebsite

The aim of this paper is to study the role of gold (Au) induced crystallization on amorphous silicon (a-Si) films produced by low pressure chemical vapor deposition (LPCVD) at low process temperatures (550 °C) to allow the use of glass substrates. Concerning the crystallization process Au was deposited by e-beam thermal evaporation over the silicon (Si), using different metal thickness, from 5 to 100 Å. The samples were then annealed at 450, 500 and 550 °C and the crystallization time was changed from 5 up to 30 h. The structure of the films was analyzed by X-ray diffraction (XRD) and spectroscopic ellipsometry (SE) while electrical conductivity measurements were performed to obtain the electrical properties of the films produced, namely the activation energy (EA) and how it changes with the Au thickness used. The data achieved show that the increase of the metal layer thickness decreases the time needed to get full crystallization. However this leads to lower conduction activation energy (EA) meaning that there is also an increase of Au incorporation that leads to the production of doped films. © 2004 Elsevier B.V. All rights reserved.

Pereira, L.a, Beckers Martins Fortunato Martins M. b R. M. "Optimization of the metal/silicon ratio on nickel assisted crystallization of amorphous silicon." Materials Research Society Symposium Proceedings. Vol. 869. 2005. 45-50. Abstract

The aim of this work is to optimize the metal/silicon ratio on nickel metal induced crystallization of silicon. For this purpose amorphous silicon layers with 80, 125 and 220 nm thick were used on the top of which 0.5 nm of Ni was deposited and annealed during the required time to full crystallize the a-Si. The data show that the 80 nm a-Si layer reaches a crystalline fraction of 95.7% (as detected by spectroscopic ellipsometry) after annealed for only 2 hours. No significant structural improvement is detected by ellipsometry neither by XRD when annealing the films for longer times. However, on 125 nm thick samples, after annealing for 2 hours the crystalline fraction is only 59.7%, reaching a similar value to the one with 80 nm only after 5 hours, with a crystalline fraction of 92.2%. Here again no significant improvements were achieved by using longer annealing times. Finally, the 220 nm thick a-Si sample is completely crystallized only after 10 hours annealing. These data clear suggest that the crystallization of thicker a-Si layers requires thicker Ni films to be effective for short annealing times. A direct dependence of the crystallization time on the metal/silicon ratio was observed and estimated. © 2005 Materials Research Society.

e d Pereira, F.M.a b, Bernacka-Wojcik Ribeiro Lobato Fortunato Martins Igreja Jorge Águas Oliva I. a R. S. "Hybrid microfluidic platform for multifactorial analysis based on electrical impedance, refractometry, optical absorption and fluorescence." Micromachines. 7 (2016). AbstractWebsite

This paper describes the development of a novel microfluidic platform for multifactorial analysis integrating four label-free detection methods: electrical impedance, refractometry, optical absorption and fluorescence. We present the rationale for the design and the details of the microfabrication of this multifactorial hybrid microfluidic chip. The structure of the platform consists of a three-dimensionally patterned polydimethylsiloxane top part attached to a bottom SU-8 epoxy-based negative photoresist part, where microelectrodes and optical fibers are incorporated to enable impedance and optical analysis. As a proof of concept, the chip functions have been tested and explored, enabling a diversity of applications: (i) impedance-based identification of the size of micro beads, as well as counting and distinguishing of erythrocytes by their volume or membrane properties; (ii) simultaneous determination of the refractive index and optical absorption properties of solutions; and (iii) fluorescence-based bead counting. © 2016 by the authors.

Pereira, L., Águas Gomes Barquinha Fortunato Martins H. L. P. "Nanostructured silicon based thin film transistors processed in the plasma dark region." Journal of Nanoscience and Nanotechnology. 10 (2010): 2938-2943. AbstractWebsite

Nanostructured silicon (na-Si:H) thin films were fabricated using plasma enhanced chemical vapour deposition (PECVD) technique under high silane hydrogen dilution and a discharge frequency of 27 MHz, where the substrate was located in the dark region of the plasma, protected by a grounded metal grid. By not exposing the growth surface directly to the plasma we avoid the silicon growth surface to sustain a high ion bombardment leading to a less defective surface and highly compact films. The intrinsic films grown under these conditions were used to produce the channel region of thin film transistors (TFTs) with a bottom gate staggered configuration, integrating different dielectric layers. The devices produced exhibit a field effect mobility close to 1.84 cm 2 V -1S -1, threshold voltage around 2 V, on/off ratio above 10 7 and sub-threshold slope below 0.5 V/decade, depending on the dielectric used. Copyright © 2010 American Scientific Publishers All rights reserved.

Pereira, L.a, Barquinha Gonçalves Vilà Olziersky Morante Fortunato Martins P. a G. a. "Sputtered multicomponent amorphous dielectrics for transparent electronics." Physica Status Solidi (A) Applications and Materials Science. 206 (2009): 2149-2154. AbstractWebsite

In this work, we present the structural and electrical properties of HfO 2, HfO 2 +SiO 2, and HfO 2 +Al 2O 3 dielectric composite layers deposited by sputtering without any intentional substrate heating. The films were deposited on glass and 〈100〉 crystalline silicon (c-Si) substrates from ceramic targets by using argon (Ar) and oxygen (O 2) as sputtering and reactive gases, respectively. The incorporation of SiO 2 and Al 2O 3 into hafnia was obtained by co-sputtering and itwas controlled by adjusting the ratio of r.f. power applied between the targets. The HfO 2 films present a microcrystalline structure, when deposited at room temperature (RT). The lowest leakage current in c-Si MIS (Metal-Insulator- Semiconductor) structures (below 10 9A/cm 2 at 10V on films with a thickness around 180 nm) was obtained for an Ar/O 2 ratio of 14:1 sccm, and further increase in O 2 flow does not enhance the electrical characteristics. The codeposition of SiO 2 or Al 2O 3 with hafnia has a strong influence on the structure of the resulting films since they become amorphous. The leakage current in MISstructures incorporating these multi-component dielectrics is reduced at least by a factor of 2, which is accompanied by an increase on the band gap. The dielectric constant is decreased due to the lower values for SiO 2 and Al 2O 3. © 2009 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.

Pereira, L., Raniero Barquinha Fortunato Martins L. P. E. "Impedance study of the electrical properties of poly-Si thin film transistors." Journal of Non-Crystalline Solids. 352 (2006): 1737-1740. AbstractWebsite

The aim of this work is to study the electrical characteristics of polycrystalline silicon (poly-Si) thin film transistors (TFTs) using spectroscopic impedance technique, where the poly-Si active layer was obtained by metal induced crystallization of amorphous silicon. From the study performed a theoretical model that fitted the impedance data is proposed, in order to obtain the separate contributions of each region that constitutes the TFT namely the channel, non accumulated region and contacts. © 2006 Elsevier B.V. All rights reserved.

Pereira, L.a, Aguas Beckers Martins Fortunato Martins H. a M. b. "Characterization of nickel induced crystallized silicon by spectroscopic ellipsometry." Materials Research Society Symposium Proceedings. Vol. 910. 2007. 529-534. Abstract

In this work Spectroscopic Ellipsometry (SE) was used to study metal induced crystallization (MIC) on amorphous silicon films in order to analyze the influence of different annealing conditions on their structural properties. The variation of the metal thickness has shown to be determinant on the time needed to full crystallize silicon films. Films of 100 nm thickness crystallize after 2h at 500°C using 1 nm of Ni deposited on it. When reducing the average metal thickness down to 0.05 nm the same silicon film will need almost 10 hours to be totally crystallized. Using a new approach on the modelling procedure of the SE data we show to be possible to determine the Ni remaining inside the crystallized films. The method consists in using Ni as reference on the Bruggeman Effective Medium Approximation (BEMA) layer that will simulated the optical response of the crystallized silicon. Silicon samples and metal layers with different thicknesses were analyzed and this new method has shown to be sensible to changes on the initial metal/silicon ratio. The nickel distribution inside the silicon layers was independently measured by Rutherford Backscattering Spectroscopy (RBS) to check the data obtained from the proposed approach. © 2006 Materials Research Society.

Pereira, L., Barquinha Fortunato Martins P. E. R. "Influence of metal induced crystallization parameters on the performance of polycrystalline silicon thin film transistors." Thin Solid Films. 487 (2005): 102-106. AbstractWebsite

In this work, metal induced crystallization using nickel was employed to obtain polycrystalline silicon by crystallization of amorphous films for thin film transistor applications. The devices were produced through only one lithographic process with a bottom gate configuration using a new gate dielectric consisting of a multi-layer of aluminum oxide/titanium oxide produced by atomic layer deposition. The best results were obtained for TFTs with the active layer of poly-Si crystallized for 20 h at 500 °C using a nickel layer of 0.5 nm where the effective mobility is 45.5 cm2 V-1 s-1. The threshold voltage, the on/off current ratio and the sub-threshold voltage are, respectively, 11.9 V, 5.55×104 and 2.49 V/dec. © 2005 Elsevier B.V. All rights reserved.

Pereira, L., Barquinha Fortunato Martins P. E. R. "Poly-Si thin film transistors: Effect of metal thickness on silicon crystallization." Materials Science Forum. 514-516 (2006): 28-32. AbstractWebsite

In this work metal induced crystallization (MIC) using nickel (Ni) was employed to obtain poly-Si by crystallization of amorphous films for application as active layer in TFTs. Ni layers with thicknesses of 0.5 nm, 1 nm and 2 nm were used to crystallize the silicon. The TFTs were produced with a bottom gate configuration using a multi-layer Al2O3/TiO2 insulator produced by atomic layer deposition (ALD) as gate dielectric. The best performances of the TFT produced were obtained when using very thin Ni layers for the crystallization. This is attributed to a lower metal contamination and to the enhancement of grain size, as a result of the lower nucleation density achieved, when using the thinnest Ni layer. Devices that exhibit effective mobility of 45.5 cm2V-1s-1 and an on/off ratio of 5.55×104 were produced using a 0.5 nm Ni layer to crystallize the active channel area.

Pereira, L., Águas Fortunato Martins H. E. R. "Nanostructure characterization of high k materials by spectroscopic ellipsometry." Applied Surface Science. 253 (2006): 339-343. AbstractWebsite

In this work, the optical and structural properties of high k materials such as tantalum oxide and titanium oxide were studied by spectroscopic ellipsometry, where a Tauc-Lorentz dispersion model based in one (amorphous films) or two oscillators (microcrystalline films) was used. The samples were deposited at room temperature by radio frequency magnetron sputtering and then annealed at temperatures from 100 to 500 °C. Concerning the tantalum oxide films, the increase of the annealing temperature, up to 500 °C does not change the amorphous nature of the films, increasing, however, their density. The same does not happen with the titanium oxide films that are microcrystalline, even when deposited at room temperature. Data concerning the use of a four-layer model based on one and two Tauc-Lorentz dispersions is also discussed, emphasizing its use for the detection of an amorphous incubation layer, normally present on microcrystalline films grown by sputtering. © 2006 Elsevier B.V. All rights reserved.

Pereira, L.a, Barquinha Fortunato Martins Kang Kim Lim Song Park P. a E. a. "High k dielectrics for low temperature electronics." Thin Solid Films. 516 (2008): 1544-1548. AbstractWebsite

In this work the electrical and structural properties of two high k materials as hafnium oxide (HfO2) and tantalum oxide (Ta2O5) produced at room temperature are exploited. Aiming low temperature processing two techniques were employed: r.f. sputtering and electron beam evaporation. The sputtered HfO2 films present a nanocrystalline structure when deposited at room temperature. The same does not happen for the evaporated films, which are essentially amorphous. The density and the electrical performance of both sputtered and evaporated films are improved after annealing them at 200 °C. On the other hand, the Ta2O5 samples deposited at room temperature are always amorphous, independently of the technique used. The density and electrical performance are not so sensitive to the annealing process. The set of data obtained show that these dielectrics processed at temperatures below 200 °C present promising properties aiming to produce devices at low temperature with improved interface properties and reduced leakage currents. © 2007 Elsevier B.V. All rights reserved.

Pereira, L., Barquinha Fortunato Martins P. E. R. "Influence of the oxygen/argon ratio on the properties of sputtered hafnium oxide." Materials Science and Engineering B: Solid-State Materials for Advanced Technology. 118 (2005): 210-213. AbstractWebsite

In this work we have focused our attention on the role of the gas mixture (O2/Ar) used during HfO2 thin film processing by r.f. magnetron sputtering, to produce dielectrics with suitable characteristics to be used as gate dielectric. Increasing the O2/Ar ratio from 0 to 0.2, the films properties (optical gap, permittivity, resistivity and compactness) are improved. At these conditions, films with a band gap around 5 eV were produced, indicating a good stoichiometry. Also the flat band voltage has a reduction of almost three times indicating also a reduction of the same order on the fixed charge density at the semiconductor-insulator interface. The dielectric constant is around 16 which is very good, since the surface of the silicon where the HfO2 films were deposited contains a SiO 2 layer of about 3 nm that gives an effective dielectric constant above 20, close to the HfO2 stoichiometric value (∼25). Further increase on the O2/Ar ratio does not produce significant improvements. © 2004 Elsevier B.V. All rights reserved.

Pereira, L.a, Águas Beckers Martins Fortunato Martins H. a M. b. "Spectroscopic ellipsometry study of nickel induced crystallization of a-Si." Journal of Non-Crystalline Solids. 352 (2006): 1204-1208. AbstractWebsite

The aim of this work is to present a spectroscopic ellipsometry study focused on the annealing time effect on nickel metal induced crystallization of amorphous silicon thin films. For this purpose silicon layers with 80 and 125 nm were used on the top of which a 0.5 nm Ni thick layer was deposited. The ellipsometry simulation using a Bruggemann Effective Medium Approximation shows that films with 80 nm reach a crystalline fraction of 72% after 1 h annealing, appearing to be full crystallized after 2 h. No significant structural improvement is detected for longer annealing times. On the 125 nm samples the crystalline volume fraction after 1 h is only around 7%, requiring 5 h to get a similar crystalline fraction than the one achieved with the thinner film. This means that the time required for full crystallization will be strongly determined by the Si layer thickness. Using a new fitting approach the Ni content within the films was also determined by SE and related to the silicon film thickness. © 2006 Elsevier B.V. All rights reserved.