Prabakaran, R., Aguas Pereira Elangovan Fortunato Martins Ferreira H. L. E. "
Optical and microstructural investigations of porous silicon coated with a-Si:H using PECVD technique."
Materials Science Forum. 587-588 (2008): 308-312.
AbstractIn the present work, the spectroscopic ellipsometry (1.5 - 5.5 eV) was used to investigate the effects of current density induced microstructural variations and their influence on the electronic states of as-prepared and a-Si:H coated porous silicon (PS). The pseudodielectric responses of the low and high current densities (5 and 40 mA/cm2) were analyzed using a multilayer model within the effective medium approximation. The FTIR investigation reveals me enhancement of surface oxide (Si-Ox) layer with current density and the improvement of the Si-Hx band after a-Si:H coating.
Pimentel, A.C., Gonçalves Marques Martins Fortunato A. A. R. "
Zinc oxide thin films used as an ozone sensor at room temperature."
Materials Research Society Symposium Proceedings. Vol. 915. 2006. 243-248.
AbstractIn this paper we present results of intrinsic/non doped zinc oxide films deposited at room temperature by rf magnetron sputtering able to be used as a truly semiconductor on electronic devices like ozone gas sensors and ultra-violet detectors. The produced films are polycrystalline with a c-axis preferential orientation parallel to the substrate. The films' resistivity varies from 4.0×10-2 Ωcm to 1.0×10-9 Ωcm, depending on the deposition conditions used (rf power density and oxygen partial pressure), which turns not affecting the optical properties (in average a transmittance of around 85 % and an optical band gap of about 3.44 eV, independent of the deposition conditions used). When exposed to UV light the sensor response based on these films may exceed more than 5 orders of magnitude, recovering to the initial state in the presence of ozone. The sensitivity of the films is improved when the oxygen partial pressure increases and the rf power density used decreases, due to changes on the structural properties of the films. © 2006 Materials Research Society.
Pereira, L.a, Martins Schell Fortunato Martins R. M. S. b. "
Nickel-assisted metal-induced crystallization of silicon: Effect of native silicon oxide layer."
Thin Solid Films. 511-512 (2006): 275-279.
AbstractThis work focuses on the role of the native oxide layer (SiO2) on the nickel (Ni)-assisted crystallization of amorphous silicon (a-Si). In some samples, the native oxide was removed using a HF-diluted solution before Ni layers with 0.5 nm be deposited on a-Si. The results show that the presence of a thin SiO2 layer of about 3 nm between the a-Si and the Ni delays the crystallization process. Ellipsometry data show that, after annealing for 5 h at 500 °C, the HF-cleaned sample presents a crystalline fraction of 88%, while the one with the native oxide has only 35%. This difference disappears after 20 h where both samples present similar crystalline fraction. These facts are also reflected on the film's electrical properties, where the activation energy for samples annealed for 5 h rises from 0.42 eV to 0.55 eV, when the oxide layer is removed. After 20 h and 30 h, the activation energy is around 0.55 eV for both kinds of samples, meaning that films with similar electrical properties are now obtained. However, the XRD data suggest the presence of some structural differences attributed to slight differences on the crystallization process. © 2005 Elsevier B.V. All rights reserved.
Pereira, L.a, Aguas Beckers Martins Fortunato Martins H. a M. b. "
Characterization of nickel induced crystallized silicon by spectroscopic ellipsometry."
Materials Research Society Symposium Proceedings. Vol. 910. 2007. 529-534.
AbstractIn this work Spectroscopic Ellipsometry (SE) was used to study metal induced crystallization (MIC) on amorphous silicon films in order to analyze the influence of different annealing conditions on their structural properties. The variation of the metal thickness has shown to be determinant on the time needed to full crystallize silicon films. Films of 100 nm thickness crystallize after 2h at 500°C using 1 nm of Ni deposited on it. When reducing the average metal thickness down to 0.05 nm the same silicon film will need almost 10 hours to be totally crystallized. Using a new approach on the modelling procedure of the SE data we show to be possible to determine the Ni remaining inside the crystallized films. The method consists in using Ni as reference on the Bruggeman Effective Medium Approximation (BEMA) layer that will simulated the optical response of the crystallized silicon. Silicon samples and metal layers with different thicknesses were analyzed and this new method has shown to be sensible to changes on the initial metal/silicon ratio. The nickel distribution inside the silicon layers was independently measured by Rutherford Backscattering Spectroscopy (RBS) to check the data obtained from the proposed approach. © 2006 Materials Research Society.