Rodrigo Martins

Titanium oxide (TiO 2) finds potential applications in various fields such as solar cells, optical coatings due to its high refractive index and it also has been widely used in memory devices owing to its high dielectric constant. TiO 2 films have been deposited on p-type silicon (100) substrates by RF magnetron sputtering technique. Thickness, structure and surface morphology of the films were analyzed by using α-step profilometer, Raman spectroscopy and atomic force microscope respectively. Thin film capacitors of the type Al/TiO 2/Si were fabricated by evaporation of Aluminium on to the TiO 2 films. The current - voltage and capacitance - voltage characteristics were carried out to understand the electrical conduction and dielectric properties of the deposited films with a stack of Al/TiO 2/Si. The leakage current density was decreased and capacitance was increased with increase of substrate bias voltage.

Two self-buffer layers were grown on c-plane sapphire substrates by atmospheric MOCVD method using DEZn, tert-butanol as precursors and H 2 as carrier gas. Then, they were respectively annealed in growth process and oxygen environment. After that, ZnO films were respectively grown on them. XRD spectra show that all the films were grown in [002] orientation. Furthermore, the film with a buffer layer annealed in oxygen exhibits much higher crystal quality. Its FWHM of the rocking curve is only 567arcsec. Furthermore, its Raman scattering spectrum appears a much stronger E2 mode peak at 436cm-1 and its PL spectrum appears a shoulder at 3.367eV on the higher energy side. © 2006 WILEY-VCH Verlag GmbH & Co. KGaA,.

This work deals with the role of hydrogen dilution and filament temperature on the morphology, structure and electrical properties of nanocrystalline boron doped silicon carbide thin films produced by hot-wire technique. The structural and morphological data obtained by XRD, SEM and micro-Raman show that for filament temperatures and hydrogen dilutions above 2100 °C and 90%, respectively, the surface morphology of the films is granular with a needle shape, while for lower filament temperatures and hydrogen dilutions the surface morphology gets honeycomb like. The SIMS analysis reveals that films produced with filament temperatures of about 2200 °C and hydrogen dilution of 99% present a higher hydrogen and carbon incorporation than the films produced at lower temperatures and hydrogen dilutions. These results agree with the electrical and optical characteristics recorded that show that the films produced exhibit optical gaps in the range from 1.8 to 2 eV and transverse conductivities ranging from 10-1 S/cm to 10-3 S/cm, consistent with the degree of films crystallinity and carbon incorporation recorded.

Large area thin film position sensitive detectors based on amorphous silicon technology have been prepared on polyimide substrates using the conventional plasma enhanced chemical vapour deposition technique. The sensors have been characterised by spectral response, illuminated I-V characteristics and position detectability measurements. The obtained one dimensional position sensors with 5 mm wide and 60 mm long present a maximum spectral response at 600 nm, an open circuit voltage of 0.6 V° and a position detectability with a correlation of 0.9989 associated to a standard deviation of 1 × 10-2, comparable to those ones produced on glass substrates. The surface of the sensors at each stage of fabrication was investigated by Atomic Force Microscopy.

We have developed a rectangular dual-axis large area Position Sensitive Detector (PSD), with 5 cm×5 cm detection area, based on PIN hydrogenated amorphous silicon (a-Si:H) technology, produced by Plasma Enhanced Chemical Vapor Deposition (PECVD). The metal contacts are located in the four edges of the detected area, two of them located on the back side of the ITO/PIN/Al structure and the others two located in the front side. The key factors of the detectors resolution and linearity are the thickness uniformity of the different layers, the geometry and the contacts location. Besides that, edge effects on the sensor's corner disturb the linearity of the detector. In this paper we present results concerning the linearity of the detector as well as its optoelectronic characteristics and the role of the i-layer thickness on the final sensor performances.

We present the modelling of a new two-terminal and low-voltage operating optoelectronic device based on MIS silicon structure with multichannel insulator and having as gate a transparent metallic tin-doped indium oxide (ITO) layer deposited by spray pyrolysis technique over the insulator layer. ITO layer has a multiple non-rectifier electrical contact with silicon substrate, in the SiO2 channel's region. Construction details of the process, together with its operating characteristics are given. The devices developed do not require external active electronic components (transistors, microschemes) to execute their functions and to transform analogue input optical signals to digital output form, highly important for a wide range of optoelectronic applications.

A linear array thin film position sensitive detector (LTFPSD) based on hydrogenated amorphous silicon (a-Si:H) is proposed for the first time, taking advantage of the optical properties presented by a-Si:H devices we have developed a LTFPSD with 128 integrated elements able to be used in 3-D inspections/measurements. Each element consists on a one-dimensional LTFPSD, based on a p.i.n. diode produced in a conventional PECVD system, where the doped layers are coated with thin resistive layers to establish the required device equipotentials. By proper incorporation of the LTFPSD into an optical inspection camera it is possible to acquire information about an object/surface, through the optical cross-section method. The main advantages of this system, when compared with the conventional CCDs, are the low complexity of hardware and software used and that the information can be continuously processed (analogue detection).

In this paper we report the success in fabricating FTO/Si surface-barrier photodiodes produced by spray pyrolysis deposition technique, under ambient conditions. Three types of photodetectors for low-voltage-bias operation were developed based on high-resistivity silicon: 1. X-Ray detectors with energy resolution of 16.5% at 661.5 keV (137Cs source), consisting of surface-barrier PIN photodiode with an active area of 50 mm2 operating at 5 V reverse bias, scintillator based on monocrystalline Bi4Ge3O12 and preamplifier (noise of 250 e- RMS.); 2. Fast-response surface-barrier FTO/n–n+ silicon epitaxial photodiodes, operating at 10 V bias with rise times of 2 ns at λ = 0.85 μm; 3. Radiation-resistant drift epitaxial surface-barrier PIN photodiodes for unbiased operating conditions, with an exponential impurity distribution in a 8 μm thick epitaxial layer. A built-in electrical field due to the carrier concentration distribution in the epitaxial layer provides a considerable improvement in the `critical fluence' value (3×1014 cm-2) for neutron irradiation.

The devices analyzed in this work present an S-shape J-V characteristic when illuminated. By changing the light flux a non linear dependence of the photocurrent with illumination is observed. Thus a low intensity light beam can be used to probe the local illumination conditions, since a relationship exists between the probe beam photocurrent and the steady state illumination. Numerical simulation studies showed that the origin of this S-shape lies in a reduced electric field across the intrinsic region, which causes an increase in the recombination losses. Based on this, we present a model for the device consisting of a modulated barrier recombination junction in addition to the p-i-n junction. The simulated results are in good agreement with the experimental data. Using the presented model a good estimative of the LSP signal under different illumination conditions can be obtained, thus simplifying the development of applications using the LSP as an image sensor, with advantages over the existing imaging systems in the large area sensor fields with the low cost associated to the amorphous silicon technology. © 2007 Materials Research Society.

The introduction into a traditional p.i.n structure of two defective buffer layers near the p/i and i/n interfaces can improve the device stability and efficiency through an enhancement of the electric field profile at the interfaces and a reduction of the available recombination bulk centers. The defectous layer ("i′-layer"), grown at a higher power density, present a high density of defects and acts as "gettering centers" able to tailor light induced defects under degradation conditions. If the i-layer density of states remains below 1016 eV-1 cm-3 and assuming a Gaussian distribution of defect states, the gettering center distribution will not affect significantly the carrier population but only its spatial distribution. We report here about a device numerical simulation that allows us to analyse the influence of the "i′-layer" position, thickness and density of states on the a-Si: H solar cells performances. Results of some systematic simulation from the ASCA program (Amorphous Solar Cell Analysis), and for different configurations will be presented. © 1994 Materials Research Society.

Molybdenum doped indium oxide (IMO) thin films rf sputtered at room temperature were studied as a function of oxygen volume percentage (O 2 vol. %) varied between 0 and 17.5. The as-deposited films were amorphous irrespective of O2 vol. %. The minimum transmittance (<10 %) of the films deposited without oxygen has been increased on introducing oxygen (3.5 O2 vol. %) to a maximum of 90 %. The optical band gap has been increased from 3.80 eV (without oxygen) to 3.92 eV (3.5 O 2 vol. %). The films were highly resistive and the hall coefficients were detectable only for the films deposited without oxygen. In order to increase the electrical conductivity, the films were annealed in the range 100-500° C in open-air and N2/H: gas for 1 hour. The annealed films become polycrystalline with enhanced electrical and optical properties. The effect of annealing conditions on these films will be presented and discussed in detail. © 2006 Materials Research Society.

In this work we present sputtered multicomponent dielectrics based on mixtures of HfO 2 and SiO 2. This way it is possible to get stable amorphous structure up to 800°C, that does not happen for pure HfO 2, for instance, that present a polycrystalline structure when deposited without any intentional substrate heating. Besides, also the band gap of the resulting films is increased when compared with pure HfO2 that theoretically is an advantage in getting a suitable band offset with the semiconductor layer on oxide TFTs. Concerning the electrical characterization, the leakage current on c-Si MIS structures is low as 10 -9 Acm -2 at 10 V. The amorphous structure of the films also lead to better dielectric/semiconductor interfaces, as suggested by C-V characteristics on GIZO MIS structures, which do not present strong variation with frequency. On other hand, the dielectric constant decreases due to the incorporation of SiO 2 and Al 2O 3. Further improvement on insulating and interface characteristics is achieved using multilayer stacks and substrate bias during deposition. © 2012 Copyright Society of Photo-Optical Instrumentation Engineers (SPIE).

The recent application of wide band gap oxide semiconductors to transparent thin film transistors (TTFTs) is making a fast and growing (r)evolution on the contemporary solid-state electronics. In this paper we present some of the recent results we have obtained using wide band gap oxide semiconductors, like indium zinc oxide, produced by rf sputtering at room temperature. The devices work in the enhancement mode and exhibit excellent saturation drain currents. On-off ratios above 106 are achieved. The optical transmittance data in the visible range reveals average transmittance higher than 80%, including the glass substrate. Channel mobilities are also quite respectable, with some devices presenting values around 25 cm2/Vs, even without any annealing or other post deposition improvement processes. The high performances presented by these TTFTs associated to a high electron mobility, at least two orders of magnitude higher than that of conventional amorphous silicon TFTs and a low threshold voltage, opens new doors for applications in flexible, wearable, disposable portable electronics as well as battery-powered applications.

This paper presents the results of a preliminary study to examine the ability of post-silicon devices for analog processing. It is focused on the latest thin-film transistors (TFTs) with amorphous gallium-indium-zinc oxide (a-GIZO) as active layer. Three circuit configurations are presented: a differential pair and two multiplier topologies. Both triode and saturation regions of operation are included in the analysis, with the devices set to remain in strong accumulation. A neural model, which is developed based on the measured data of the TFTs, is used for the circuit simulations in the Cadence Virtuoso environment. The analog multipliers simulation results are compared against the expected functional results. © 2012 IEEE.

The role of the deposition pressure (p) and the type of filaments (tungsten, W or tantalum, Ta) used to produce large area (10cm×10cm) n-type Si:H films by hot wire chemical vapour (HW-CVD) deposition technique was investigated. The data show that the electro-optical properties of the films produced are dependent on the gas pressure used. In the pressure range of 1×10-3 Torr to 1.0 Torr, the room dark conductivity (σd) varies from 1×10-8 to 2 S/cm for films produced at the same hydrogen dilution and filament temperature (Tfil). On the other hand, the hydrogen concentration (CH) decreases from 10% to 2%, while the growth rate (R) shows an exponential increase, from 1 to 9 Å/s. The SIMS analysis, within the detection limits, does not reveal the existence of any significant W or Ta contamination in the films produced.

In this work, we show results concerning electro-optical properties, composition and morphology of nanocrystalline hydrogenated undoped silicon (nc-Si:H) films produced by hot wire plasma assisted chemical vapour deposition process (HWPA-CVD) and exhibiting a compact granular structure, as revealed by SEM micrographs. This was also inferred by infrared spectra, which does not present the SiO vibration band located at 1050-1200 cm-1, even when samples have long atmospheric exposition. The photoconductivity measured at room temperature also does not change when samples have a long time exposition to the air or to the light irradiation. The influence of hydrogen dilution on the properties of the films was also investigated.

This paper presents the process conditions that lead to the production of nanostructured silicon films grown by plasma enhanced chemical vapour deposition close to the so-called gamma regime (powder formation), highly dense and with low density of bulk states. Thus, the powder management is one important issue to be addressed in this paper. As a general rule we observed that high quality films (low density of states and high μτ products) are obtained when films are grown under low ion bombardment at high hydrogen dilution and deposition pressure conditions, to allow the proper surface passivation and surface activation.

In this paper we present results concerning the influence of laser energy and shot density on the electrical resistance, X-ray diffraction pattern, and structure obtained by SEM, on recrystallized a-Si:H thin films produced by using a Nd-YAG laser, working in a wavelength of 532 nm. The base material (undoped and doped a-Si:H) was obtained by Plasma Enhanced Chemical Vapour Deposition (PECVD). The structure and electrical characteristics of the recrystallized thin films are dependent on the laser beam energy density, beam spot size and the number of shots applied to the base a-Si:H thin film used. Overall, the data show recrystallized material with grain sizes larger than 1μm, where the electrical resistance of both, undoped and doped materials, can be varied up to 5 orders of magnitude, by the proper choice of the recrystallization conditions.

In this article we review the recent progress in n- and p-type oxide based thin film transistors (TFT), with special emphasis to solution-processed and p-type, and we will summarize the major milestones already achieved with this emerging and very promising technology.

A Linear array Thin Film Position Sensitive Detector (LTFPSD) based on hydrogenated amorphous silicon (a-Si:H) is proposed for the first time, taking advantage of the optical properties presented by a-Si:H devices we have developed a LTFPSD with 128 integrated elements able to be used in 3D inspections/measurements. Each element consists on an one-dimensional TFPSD, based on a p.i.n. diode produced in a conventional PECVD system, where the doped layers are coated with thin resistive layers to establish the required device equipotentials. By proper incorporation of the LTFPSD into an optical inspection camera it will be possible to acquire information about an object/surface, through the optical cross-section method. The main advantages of this system, when compared with the conventional CCDs, are the low complexity of hardware and software used and that the information can be continuously processed (analogue detection).

We report high performance ZnO thin film transistor (ZnO-TFT) fabricated by rf magnetron sputtering at room temperature with a bottom gate configuration. The ZnO-TFT operates in the enhancement mode with a threshold voltage of 19 V, a field effect mobility of 28 cm2/Vs, a gate voltage swing of 1.39 V/decade and an on/off ratio of 3×105. The ZnO-TFT present an average optical transmission (including the glass substrate) of 80% in the visible part of the spectrum. The combination of transparency, high field-effect mobility and room temperature processing makes the ZnO-TFT a very promising low cost optoelectronic device for the next generation of invisible and flexible electronics.

Thin films of indium molybdenum oxide (IMO) were rf sputtered onto glass substrates at room temperature. The films were studied as a function of sputtering power (ranging 40-180 W) and sputtering time (ranging 2.5-20 min). Thickness of the films found varied between 50-400 nm. The films were characterized for their structural (XRD), electrical (Hall measurements) and optical (Transmittance spectra) properties. XRD studies revealed that the films are amorphous for the sputtering power ≤ 100 W and deposition time ≤ 5 min. All the other films are polycrystalline and the strongest refection along (222) plane showing a preferential orientation. A minimum bulk resistivity of 2.65 × 10-3 Ω-cm and a maximum carrier concentration of 4.16 × 1020 cm-3 have been obtained for the films sputtered at 180 W (10 min). Whereas maximum mobility (19.5 cm2 V-1 s-1) has been obtained for the films sputtered at 80 W (10 min). A maximum visible transmittance of 90% (500 nm) has been obtained for the films sputtered at 80 W (10 min) with a minimum of 27% for those sputtered at 180 W. The optical band gap of the films found varying between 3.75 and 3.90 eV for various sputtering parameters. © 2006 Materials Research Society.

A novel linear analog adder is proposed only with n-type enhancement IGZO TFTs that computes summation of four voltage signals. However, this design can be easily extended to perform summation of higher number of signals, just by adding a single TFT for each additional signal in the input block. The circuit needs few number of transistors, only a single power supply irrespective of the number of voltage signals to be added, and offers good accuracy over a reasonable range of input values. The circuit was fabricated on glass substrate with the annealing temperature not exceeding 200° C. The circuit performance is characterized from measurements under normal ambient at room temperature, with a power supply voltage of 12 V and a load of ≈ 4 pF. The designed circuit has shown a linearity error of 2.3% (until input signal peak to peak value is 2 V), a power consumption of 78 μW and a bandwidth of ≈ 115 kHz, under the worst case condition (when it is adding four signals with the same frequency). In this test setup, it has been noticed that the second harmonic is 32 dB below the fundamental frequency component. This circuit could offer an economic alternative to the conventional approaches, being an important contribution to increase the functionality of large area flexible electronics. © 2016 IEEE.

Here we describe an innovative optoelectronic platform which enables the specific detection of unamplified nucleic acid sequences with the integration of oligonucleotide-derivatized gold nanoparticles, a colour sensor and a light emission source for a colorimetric detection method. This new low cost, fast and simple optoelectronic platform permits detection of less than 1 picomole quantities of nucleic acid without target or signal amplification. ©2007 IEEE.