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Prabakaran, R., Aguas Fortunato Martins Ferreira H. E. R. "n-PS/a-Si:H heterojunction for device application." Journal of Non-Crystalline Solids. 354 (2008): 2632-2636. AbstractWebsite

In this work, we investigate the role of amorphous silicon (a-Si:H) thin films deposited by a plasma enhanced chemical vapor deposition (PECVD) technique on porous silicon (PS) to facilitate its water vapor and oxygen gas sensing properties using its electrical response. Overall we notice a rectifying behavior from a-Si:H/PS heterojunction device, where a current enhancement of one and four orders of magnitude was observed in the presence of oxygen gas and water vapor, in comparison with atmospheric air at room temperature, respectively. The photoluminescence (PL) investigation of PS shows a slight blue shift in the PL emission band from 1.72 to 1.77 eV and the intensity of the PL is enhanced by a factor of 5.4 with increase of porosity from 21% to 77%. This PL emission may originate from the O-Si-H related absorbance bands. Alternatively, quenching of the PL intensity was observed after a-Si:H films were deposited on PS specimens. Besides, micro-Raman and atomic force microscopic (AFM) analyse were carried out to understand the structure and morphological features of the PS and a-Si:H/PS specimens. © 2007 Elsevier B.V. All rights reserved.

Barquinha, P., Martins Fortunato R. E. "N-type oxide semiconductor thin-film transistors." Springer Series in Materials Science. 156 (2012): 435-476. AbstractWebsite

This chapter gives an overview about GIZO TFTs, comprising an introductory section about generic TFT structure and operation, different semiconductor technologies for TFTs - with special emphasis on AOSs and particularly on GIZO - and then some experimental results obtained for GIZO TFTs fabricated in CENIMAT. Thin-film transistors (TFTs) are important electronic devices which are predominantly used as On/Off switches in active matrix backplanes of flat panel displays (FPDs), namely liquid crystal displays (LCDs) and organic light emitting device (OLED) displays. Even if a-Si:H is still dominating the TFT market in terms of semiconductor technology, oxide semiconductors are emerging as one of the most promising alternatives for the next generation of TFTs, bringing the possibility of having fully transparent devices, low processing temperature, low cost, high performance and electrically stable properties [1, 2]. Amorphous oxide semiconductors (AOS) such as Gallium-Indium-Zinc oxide (GIZO) [3, 4], even if fabricated at temperatures below 150°, are currently capable of providing transistors with field-effect mobility (μFE) exceeding 20 cm2V-1 s-1, threshold voltage (VT) close to 0V, On/Off ratios above 108, subthreshold swing (S) around 0:20V dec-1 and fully recoverable VT shift (ΔVT) lower than 0.5V after 24 h stress with constant drain current of 10 μA. © Springer-Verlag Berlin Heidelberg 2012.

Ferreira, I.M.M., Cabrita Fortunato Martins A. M. F. E. "N-type silicon films produced by hot wire technique." Materials Research Society Symposium - Proceedings. Vol. 609. 2000. A651-A656. Abstract

The role of the deposition pressure (p) and the type of filaments (tungsten, W or tantalum, Ta) used to produce large area (10cm×10cm) n-type Si:H films by hot wire chemical vapour (HW-CVD) deposition technique was investigated. The data show that the electro-optical properties of the films produced are dependent on the gas pressure used. In the pressure range of 1×10-3 Torr to 1.0 Torr, the room dark conductivity (σd) varies from 1×10-8 to 2 S/cm for films produced at the same hydrogen dilution and filament temperature (Tfil). On the other hand, the hydrogen concentration (CH) decreases from 10% to 2%, while the growth rate (R) shows an exponential increase, from 1 to 9 Å/s. The SIMS analysis, within the detection limits, does not reveal the existence of any significant W or Ta contamination in the films produced.

Ferreira, I.a, Fernandes F.Braza Vilarinho Fortunato Martins P. b E. a. "Nanocrystalline p-type silicon films produced by hot wire plasma assisted technique." Materials Science and Engineering C. 15 (2001): 137-140. AbstractWebsite

We report in this paper the influence of the rf power on the properties of p-type silicon thin films produced by hot wire plasma assisted chemical vapor deposition (HWPA-CVD) technique, using a gas mixture containing SiH4, B2H6, CH4 and H2. The influence of the rf power in the film morphology, its structure and its composition has been determined by means of scanning electron microscopy (SEM), X-ray diffraction (XRD) and infrared spectroscopy. The electrical dark conductivity, activation energy, optical band gap and growth rate values for the different rf power was also evaluated. The data achieved show that rf power rules the surface morphology, the film structure and its electrical characteristics. © 2001 Elsevier Science B.V. All rights reserved.

Ferreira, I., Fernandas Martins B. R. "Nanocrystalline silicon carbon doped films prepared by hot wire technique." Vacuum. 52 (1999): 147-152. AbstractWebsite

In this work we present data concerning the structure, composition and electro-optical performances of nanocrystalline silicon carbide doped films produced at the different filament temperatures and hydrogen dilution ratios. The XRD spectra reveal the presence of the typical Si peaks ascribed to (111) (220) and (311) diffraction planes, where no traces of the carbon peaks were found. The average grain sizes ranges from 10 nm to 30 nm, depending on the temperature of filament and hydrogen dilution used. We observed an enhancement of the peak ascribed to the (220) plane when high H dilution rates are used, meaning that the film starts being textured. The infrared data reveal the typical silicon carbide modes and a hydrogen content that varies from 3% to 1%, with the increase of the filament temperature. Besides that, the IR spectra show the typical SiO2 and SiO modes, associated to the oxide species that are mainly incorporated in the surface of the films and can be removed by proper wet etching. The planar conductivity is enhanced as the temperature of the filament is increased, being the highest conductivity achieved in the range of 0.2 (Ωcm)-1 and almost non activated. © 1998 Elsevier Science Ltd. All rights reserved.

Lyubchyk, A.a, Filonovich Mateus Mendes Vicente Leitão Falcão Fortunato Águas Martins S. A. a T. "Nanocrystalline thin film silicon solar cells: A deeper look into p/i interface formation." Thin Solid Films. 591 (2015): 25-31. AbstractWebsite

The p/i interface plays a major role in the conversion efficiency of nanocrystalline silicon (nc-Si:H) solar cells. Under plasma-enhanced chemical vapor deposition (PECVD) of the intrinsic (i) nc-Si:H layer, ion bombardment can severely affect the underlying p-doped layer and degrade the solar cell performance. The core of the present work is to investigate the effect of light and heavy ion bombardment on the structural modifications of the p-layer during the p/i interface formation. The properties of the nc-Si:H materials deposited under distinct conditions are analyzed and correlated to the deposition rate and the resulting cell efficiency. To recreate the ion bombardment during the initial stages of the i-layer deposition on the p-layer, hydrogen plasma treatment was performed for 30 s (light ion bombardment), after which a flux of silane was introduced into the deposition chamber in order to initiate the heavy ion bombardment and growth of an ultra-thin (5 nm) i-layer. The structural changes of the p-type nc-Si:H layers were observed by spectroscopic ellipsometry. The obtained results confirm that detrimental structural modifications (e.g. partial amorphization of the sub-surface region and bulk) occur in the p-layer, caused by the ion bombardment. To minimize this effect, a protective buffer layer is investigated able to improve the performance of the solar cells fabricated under increased growth rate conditions. © 2015 Elsevier B.V. All rights reserved.

Ferreira, I.M.M., Martins Cabrita Fortunato Vilarinho R. F. P. A. "Nanocrystalline undoped silicon films produce by hot wire plasma assisted technique." Materials Research Society Symposium - Proceedings. Vol. 609. 2000. A2241-A2246. Abstract

In this work, we show results concerning electro-optical properties, composition and morphology of nanocrystalline hydrogenated undoped silicon (nc-Si:H) films produced by hot wire plasma assisted chemical vapour deposition process (HWPA-CVD) and exhibiting a compact granular structure, as revealed by SEM micrographs. This was also inferred by infrared spectra, which does not present the SiO vibration band located at 1050-1200 cm-1, even when samples have long atmospheric exposition. The photoconductivity measured at room temperature also does not change when samples have a long time exposition to the air or to the light irradiation. The influence of hydrogen dilution on the properties of the films was also investigated.

Pereira, L., Águas Fortunato Martins H. E. R. "Nanostructure characterization of high k materials by spectroscopic ellipsometry." Applied Surface Science. 253 (2006): 339-343. AbstractWebsite

In this work, the optical and structural properties of high k materials such as tantalum oxide and titanium oxide were studied by spectroscopic ellipsometry, where a Tauc-Lorentz dispersion model based in one (amorphous films) or two oscillators (microcrystalline films) was used. The samples were deposited at room temperature by radio frequency magnetron sputtering and then annealed at temperatures from 100 to 500 °C. Concerning the tantalum oxide films, the increase of the annealing temperature, up to 500 °C does not change the amorphous nature of the films, increasing, however, their density. The same does not happen with the titanium oxide films that are microcrystalline, even when deposited at room temperature. Data concerning the use of a four-layer model based on one and two Tauc-Lorentz dispersions is also discussed, emphasizing its use for the detection of an amorphous incubation layer, normally present on microcrystalline films grown by sputtering. © 2006 Elsevier B.V. All rights reserved.

c Martins, R.a, Raniero Pereira Costa Aguas Pereira Silva Goncalves Ferreira Fortunato L. b L. a. "Nanostructured silicon and its application to solar cells, position sensors and thin film transistors." Philosophical Magazine. 89 (2009): 2699-2721. AbstractWebsite

This paper reports the performance of small area solar cells, 128 linear integrated position sensitive detector arrays and thin film transistors based on nanostructured silicon thin films produced by plasma-enhanced chemical vapour deposition technique, close to the onset of dusty plasma conditions, within the transition region from amorphous to microcrystalline. The small area solar cells, produced in a modified single chamber reactor, exhibited very good electrical characteristics with a conversion efficiency exceeding 9%. The 128 integrated position sensitive detector arrays, based on a similar pin structure, allow real-time 3D object imaging with a resolution higher than 90 l p/mm. The thin film transistors produced exhibited field effect mobility of 2.47 cm 2/V/s, threshold voltage of 2 V, on/off ratio larger than 10 7 and sub-threshold slopes of 0.32 V/decade, which are amongst the best results reported for this type of device. © 2009 Taylor & Francis.

Pereira, L., Águas Gomes Barquinha Fortunato Martins H. L. P. "Nanostructured silicon based thin film transistors processed in the plasma dark region." Journal of Nanoscience and Nanotechnology. 10 (2010): 2938-2943. AbstractWebsite

Nanostructured silicon (na-Si:H) thin films were fabricated using plasma enhanced chemical vapour deposition (PECVD) technique under high silane hydrogen dilution and a discharge frequency of 27 MHz, where the substrate was located in the dark region of the plasma, protected by a grounded metal grid. By not exposing the growth surface directly to the plasma we avoid the silicon growth surface to sustain a high ion bombardment leading to a less defective surface and highly compact films. The intrinsic films grown under these conditions were used to produce the channel region of thin film transistors (TFTs) with a bottom gate staggered configuration, integrating different dielectric layers. The devices produced exhibit a field effect mobility close to 1.84 cm 2 V -1S -1, threshold voltage around 2 V, on/off ratio above 10 7 and sub-threshold slope below 0.5 V/decade, depending on the dielectric used. Copyright © 2010 American Scientific Publishers All rights reserved.

Martins, R., Águas Silva Ferreira Cabrita Fortunato H. V. I. "Nanostructured silicon films produced by PECVD." Materials Research Society Symposium - Proceedings. Vol. 664. 2001. A961-A966. Abstract

This paper presents the process conditions that lead to the production of nanostructured silicon films grown by plasma enhanced chemical vapour deposition close to the so-called gamma regime (powder formation), highly dense and with low density of bulk states. Thus, the powder management is one important issue to be addressed in this paper. As a general rule we observed that high quality films (low density of states and high μτ products) are obtained when films are grown under low ion bombardment at high hydrogen dilution and deposition pressure conditions, to allow the proper surface passivation and surface activation.

Carvalho, J., Ferreira Fernandes Fidalgo Martins I. B. J. "Nd-YAG laser induced crystallization on a-Si:H thin films." Materials Research Society Symposium - Proceedings. Vol. 358. 1995. 915-920. Abstract

In this paper we present results concerning the influence of laser energy and shot density on the electrical resistance, X-ray diffraction pattern, and structure obtained by SEM, on recrystallized a-Si:H thin films produced by using a Nd-YAG laser, working in a wavelength of 532 nm. The base material (undoped and doped a-Si:H) was obtained by Plasma Enhanced Chemical Vapour Deposition (PECVD). The structure and electrical characteristics of the recrystallized thin films are dependent on the laser beam energy density, beam spot size and the number of shots applied to the base a-Si:H thin film used. Overall, the data show recrystallized material with grain sizes larger than 1μm, where the electrical resistance of both, undoped and doped materials, can be varied up to 5 orders of magnitude, by the proper choice of the recrystallization conditions.

Seiroco, H., Vincente Ferreira Fernandes Marvão Martins Fortunato Martins M. J. F. "New adhesion process based on lead-free solder applied in electronic power devices." Key Engineering Materials. 230-232 (2002): 92-95. AbstractWebsite

The aim of this paper is to present a set of electric data concerning the performances before and after ageing of Cu-Sn-Cu joins used to solder power diodes and to compare the results achieved with the ones obtained in diodes soldered using the conventional technology. The set of results achieved show that the Cu-Sn-Cu joins present even better performances than the ones exhibited by diodes soldered using the conventional technology, without requiring the use of Mo discs to be inserted between the silicon crystal and the metal contacts (stud or finger) to compensate thermal mismatches.

Fortunato, E., Barquinha Gonçalves Pereira Martins P. G. L. "New amorphous oxide semiconductor for thin film transistors (TFTs)." Materials Science Forum. 587-588 (2008): 348-352. AbstractWebsite

Thin film transistors (TFTs) have been produced by rf magnetron sputtering at room temperature, using non conventional oxide materials like amorphous indium-zinc-oxide (IZO) semiconductor, for the channel as well as for the drain and source regions. The obtained TFTs operate in the enhancement mode with threshold voltages of 2.4 V, saturation mobility of 22.7 cm2/Vs, gate voltage swing of 0.44 V/dec and an ON/OFF current ratio of 7×10 7. The high performances presented by these TFTs associated to a high electron mobility, at least two orders of magnitude higher than that of conventional amorphous silicon TFTs and a low threshold voltage, opens new doors for applications in flexible, wearable, disposable portable electronics as well as battery-powered applications.

Assunção, V., Fortunato Marques Gonçalves Ferreira Águas Martins E. A. A. "New challenges on gallium-doped zinc oxide films prepared by r.f. magnetron sputtering." Thin Solid Films. 442 (2003): 102-106. AbstractWebsite

Gallium-doped zinc oxide films were prepared by r.f. magnetron sputtering at room temperature as a function of the substrate-target distance. The best results were obtained for a distance of 10 cm, where a resistivity as low as 2. 7 × 10-4 Ω cm, a Hall mobility of 18 cm2/Vs and a carrier concentration of 1.3 × 1021 cm-3 were achieved. The films are polycrystalline presenting a strong crystallographic c-axis orientation (002) perpendicular to the substrate. The films present an overall transmittance in the visible part of the spectra of approximately 85%, on average. © 2003 Elsevier B.V. All rights reserved.

Fortunato, E.a, Gonçalves Marques Viana Águas Pereira Ferreira Vilarinho Martins A. a A. a. "New developments in gallium doped zinc oxide deposited on polymeric substrates by RF magnetron sputtering." Surface and Coatings Technology. 180-181 (2004): 20-25. AbstractWebsite

Gallium-doped zinc oxide (GZO) thin films have been deposited onto polyethylene naphthalate (PEN) substrates by r.f. magnetron sputtering at room temperature. The influence of the film thickness (from 70 to 890 nm) on the electrical, structural and morphological properties are presented. The lowest resistivity obtained was 5 × 10-4 Ω cm with a Hall mobility of 13.7 cm2/Vs and a carrier concentration of 8.6 × 1020 cm-3. These values were obtained by passivating the surface of the polymer with a thin silicon dioxide, so preventing the moisture and oxygen permeation inside the film. © 2003 Elsevier B.V. All rights reserved.

Fortunato, E., Barquinha Martins P. R. "New developments on oxide electronics." Proceedings of the International Display Workshops. Vol. 3. 2011. 1681-1684. Abstract

In this article we review the recent progress in n- and p-type oxide based thin film transistors (TFT), with special emphasis to solution-processed and p-type, and we will summarize the major milestones already achieved with this emerging and very promising technology.

Malik, A.a, Sêco Fortunato Martins Shabashkevich Piroszenko A. a E. a. "A new high ultraviolet sensitivity FTO-GaP Schottky photodiode fabricated by spray pyrolysis." Semiconductor Science and Technology. 13 (1998): 102-107. AbstractWebsite

A new high quantum efficiency gallium phosphide Schottky photodiode has been developed by spray deposition of heavily doped tin oxide films on n-type epitaxial structures, as an alternative to the conventional Schottky photodiodes using a semitransparent gold electrode. It is shown that fluorine-doped tin oxide films are more effective as transparent electrodes than tin-doped indium oxide films. The proposed photodiodes have a typical responsivity near 0.33 A W-1 at 440 nm and an unbiased internal quantum efficiency close to 100%, in the range from 250 to 450 nm. The model used to calculate the internal quantum efficiency (based on the optical constants of tin oxide films and gallium phosphide epitaxial layers) is found to be in good agreement with the experimental results. The data show that the quantum efficiency is strongly dependent on the thickness of the transparent electrode, owing to optical interference effects. The noise equivalent power for 440 nm is 2.7 × 10-15 W Hz-1/2, which indicates that these photodiodes can be used for accurate measurements in the short-wavelength range, even in the presence of stronger infrared background radiation.

Brida, D., Fortunato Águas Silva Marques Pereira Ferreira Martins E. H. V. "New insights on large area flexible position sensitive detectors." Journal of Non-Crystalline Solids. 299 (2002): 1272-1276. AbstractWebsite

In this paper we present an improved version of large area (5 mm × 80 mm) flexible position sensitive detectors deposited on polyimide (Kapton® VN) substrates with 75 μm thickness, produced by plasma enhanced chemical vapor deposition (PECVD). The structures presented by the sensors are Kapton/ZnO:Al/(pin)a-Si:H/Al and the heterostructure Kapton/Cr/(in)a-Si:H/ZnO:Al. These sensors were characterized by spectral response, photocurrent dependence as a function of light intensity and position detectability measurements. The set of data obtained on one-dimensional position sensitive detectors based on the heterostructure show excellent performances with a maximum spectral response of 0.12 A/W at 500 nm and a non-linearity of ±10%. © 2002 Elsevier Science B.V. All rights reserved.

Fortunato, E., Soares Lavareda Martins F. G. R. "New linear array thin film position sensitive detector (LTFPSD) for 3D measurements." Materials Research Society Symposium - Proceedings. Vol. 377. 1995. 797-802. Abstract

A Linear array Thin Film Position Sensitive Detector (LTFPSD) based on hydrogenated amorphous silicon (a-Si:H) is proposed for the first time, taking advantage of the optical properties presented by a-Si:H devices we have developed a LTFPSD with 128 integrated elements able to be used in 3D inspections/measurements. Each element consists on an one-dimensional TFPSD, based on a p.i.n. diode produced in a conventional PECVD system, where the doped layers are coated with thin resistive layers to establish the required device equipotentials. By proper incorporation of the LTFPSD into an optical inspection camera it will be possible to acquire information about an object/surface, through the optical cross-section method. The main advantages of this system, when compared with the conventional CCDs, are the low complexity of hardware and software used and that the information can be continuously processed (analogue detection).

Fortunato, E., Martins R. "New materials for large-area position-sensitive detectors." Sensors and Actuators, A: Physical. 68 (1998): 244-248. AbstractWebsite

Large-area thin-film position-sensitive detectors (TFPSDs) using the hydrogenated amorphous silicon (a-Si:H) technology are presented. The detection accuracy of these devices (lengths of about 80 mm) is better than ±0.5% of the value of the full scale of the sensor, the spatial resolution is better than ±20 μm, the non-linearities measured are below ±2% and the frequency response is in the range of a few kilohertz, compatible with the sampling frequency of most electromechanical assembling/control systems. The obtained results are quite promising regarding the application of these sensors to a wide variety of optical inspection systems. © 1998 Elsevier Science S.A. All rights reserved.

Fortunato, Elvira, Martins Rodrigo. "New materials for large-area position-sensitive detectors." Sensors and Actuators, A: Physical. 68 (1998): 244-248. AbstractWebsite

Large-area thin-film position-sensitive detectors (TFPSDs) using the hydrogenated amorphous silicon (a-Si:H) technology are presented. The detection accuracy of these devices (lengths of about 80 mm) is better than ±0.5% of the value of the full scale of the sensor, the spatial resolution is better than ±20 μm, the non-linearities measured are below ±2% and the frequency response is in the range of a few kilohertz, compatible with the sampling frequency of most electromechanical assembling/control systems. The obtained results are quite promising regarding the application of these sensors to a wide variety of optical inspection systems.

Gonçalves, C.a, Ferreira Fortunato Ferreira Martins Marvão Martins Harder Oppelt J. a E. a. "New metallurgical systems for electronic soldering applications." Sensors and Actuators, A: Physical. 74 (1999): 70-76. AbstractWebsite

The aim of this paper is to present results on a new soldering process based on the low-temperature solidification of intermetallic phases from the system Cu-Sn-Cu which can be employed to form a heat-resistant die-attach as well as signal and power electric contacts. Because of the total transformation into intermetallic phase, the working temperature of the bond formed is several hundred degrees Celsius higher than the process temperature (around 250°C). This process leads to a homologous temperature T/Tm of about 0.3 compared to 0.7 in the case of soft SnAg solder alloy. Therefore a better reliability of the proposed bonding process is achievable. Results of the match of the predicted volume fraction of the intermetallic forms and the experimentally measured contact volume would be also discussed, for contacts formed in power diodes.

Martins, R., Águas Cabrita Tonello Silva Ferreira Portunato Guimares H. A. P. "New nanostructured silicon films grown by pecvd technique under controlled powder formation conditions." Solar Energy. 69 (2000): 263-269. AbstractWebsite

In this paper the influence of the DC grid bias on the plasma impedance and the I-V behaviour of silane plasmas used to grow undoped amorphous silicon films by plasma enhanced chemical vapour deposition technique using a triode configuration at or close to the powder regime is studied. The aim is to determine the correlation between the r.f. power and the DC grid voltage with the plasma parameters, under isothermal gas conditions. The results should lead to the production of nanostructured films, with the required optoelectronic characteristics for photovoltaic applications. The results achieved show the existence of a boundary region close to the γ-regime (powder formed) where nanoparticles can be formed by moderated ion bombardment of the growing surface. This is characterised by the plasma resistance of the same order of magnitude of the plasma reactance. Under this condition, it is possible to grow amorphous silicon films that can incorporate nanoparticles, exhibiting photosensitivities of about 107 (two orders of magnitude larger than the one exhibited by films grown under conventional conditions) with densities of states determined by the constant photocurrent method below 3 × 1015 cm3. Apart from that, the growth of the films is less affected by light soaking than the conventional films grown by standard techniques. © 2001 Elsevier Science Ltd. All rights reserved.

Martins, R., Ferreira Cabrita Águas Silva Fortunato I. A. H. "New steps to improve a-Si:H device stability by design of the interfaces." Advanced Engineering Materials. 3 (2001): 170-173. AbstractWebsite
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