{\rtf1\ansi\deff0\deftab360

{\fonttbl
{\f0\fswiss\fcharset0 Arial}
{\f1\froman\fcharset0 Times New Roman}
{\f2\fswiss\fcharset0 Verdana}
{\f3\froman\fcharset2 Symbol}
}

{\colortbl;
\red0\green0\blue0;
}

{\info
{\author Biblio}{\operator }{\title Biblio RTF Export}}

\f1\fs24
\paperw11907\paperh16839
\pgncont\pgndec\pgnstarts1\pgnrestart
Seiroco, H., Vincente Ferreira Fernandes Marv\'e3o Martins Fortunato Martins M. J. F. "New adhesion process based on lead-free solder applied in electronic power devices." \i Key Engineering Materials\i0 . 230-232 (2002): 92-95.\par \par }