@article {Martins2000275,
	title = {Role of soldering parameters on the electrical performances presented by Cu-Sn-Cu joints used in power diodes},
	journal = {Materials Science and Engineering A},
	volume = {288},
	number = {2},
	year = {2000},
	note = {<p>cited By 1</p>
},
	pages = {275-279},
	abstract = {<p>The effects of Sn thickness electrodeposited over Cu on the structural and morphological performance of the joints formed were investigated. The electrical stability of the joints formed was analyzed under extreme aggressive conditions. Results indicated that the proposed soldering technology greatly satisfied the demands concerning soldering specifications.</p>
},
	doi = {10.1016/S0921-5093(00)00871-6},
	url = {https://www.scopus.com/inward/record.uri?eid=2-s2.0-0034272895\&partnerID=40\&md5=80ab0d0cb20cf94ac28fdb70bd6aa899},
	author = {Martins, R.a , Ferreira, J.a , Gon{\c c}alves, C.a , Nunes, P.a , Fortunato, E.a , Marv{\~a}o, A.P.b , Martins, J.I.c}
}
