@article {Ferreira2000292,
	title = {Production of low cost contacts and joins for large area devices by electrodeposition of Cu and Sn},
	journal = {Applied Surface Science},
	volume = {168},
	number = {1-4},
	year = {2000},
	note = {<p>cited By 4</p>
},
	pages = {292-295},
	abstract = {<p>The aim of this paper is to present results concerning the morphology, structure, mechanical and electrical characteristics of the new proposed Cu-Sn metallurgical alloy, which may be used in electronic joins. By proper choice of process temperature and pressure, Cu coated surfaces are soldered using Sn as pre-form. The main results achieved indicate that the formation of Cu3Sn phase begins at a temperature of about 473 K and that the Sn thickness (dSn) needed is slightly above 7 μm. Due to join wettability, higher temperatures (between 523 and 573 K) and dSn above 35 μm are required to form joins within the specifications of the electronic industry.</p>
},
	doi = {10.1016/S0169-4332(00)00627-9},
	url = {https://www.scopus.com/inward/record.uri?eid=2-s2.0-0034514366\&partnerID=40\&md5=81b7868752c4045e10af1911614e4714},
	author = {Ferreira, J.a , Seiroco, H.a , Braz Fernandes, F.a , Martins, R.a , Fortunato, E.a , Marv{\~a}o, A.P.b , Martins, J.I.c}
}
