@article {Seiroco200292,
	title = {New adhesion process based on lead-free solder applied in electronic power devices},
	journal = {Key Engineering Materials},
	volume = {230-232},
	year = {2002},
	note = {<p>cited By 0</p>
},
	pages = {92-95},
	abstract = {<p>The aim of this paper is to present a set of electric data concerning the performances before and after ageing of Cu-Sn-Cu joins used to solder power diodes and to compare the results achieved with the ones obtained in diodes soldered using the conventional technology. The set of results achieved show that the Cu-Sn-Cu joins present even better performances than the ones exhibited by diodes soldered using the conventional technology, without requiring the use of Mo discs to be inserted between the silicon crystal and the metal contacts (stud or finger) to compensate thermal mismatches.</p>
},
	url = {https://www.scopus.com/inward/record.uri?eid=2-s2.0-17544404371\&partnerID=40\&md5=ca2d573b8fbc48290036d2693ea0ff3e},
	author = {Seiroco, H., Vincente, M., Ferreira, J., Fernandes, F.B., Marv{\~a}o, A.P., Martins, J.I., Fortunato, E., Martins, R.}
}
